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Okayama, JP
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last 30 patents
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Patent Grant
Bonding material and bonding method using same
Patent number
10,903,185
Issue date
Jan 26, 2021
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Bonding material and bonding method using same
Patent number
10,328,534
Issue date
Jun 25, 2019
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Bonding material and bonding method in which said bonding material...
Patent number
9,533,380
Issue date
Jan 3, 2017
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
Publication number
20170077057
Publication date
Mar 16, 2017
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
Publication number
20160136763
Publication date
May 19, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METAL PASTE FOR JOINING, JOINING METHOD AND JOINED BODY
Publication number
20160121435
Publication date
May 5, 2016
Toyota Jidosha Kabushiki Kaisha
Masashi FURUKAWA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL...
Publication number
20150028085
Publication date
Jan 29, 2015
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR