Minehiro Itagaki

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Photo-semiconductor module and method for manufacturing the same
- Patent number 6,890,789
- Issue date May 10, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-semiconductor module and method for manufacturing the same
- Patent number 6,803,639
- Issue date Oct 12, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing mounting structure for an electronic component
- Patent number 6,749,889
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for planarizing circuit board and method for manufacturing s...
- Patent number 6,723,251
- Issue date Apr 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for planarizing circuit board and method for manufacturing s...
- Patent number 6,703,262
- Issue date Mar 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed-circuit board having projection elec...
- Patent number 6,694,613
- Issue date Feb 24, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure for an electronic component and method for produ...
- Patent number 6,569,512
- Issue date May 27, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 6,538,315
- Issue date Mar 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste, its manufacturing method, and printed wiring boar...
- Patent number 6,488,869
- Issue date Dec 3, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive composition, conductive adhesive, and their mounting str...
- Patent number 6,468,448
- Issue date Oct 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Stress relaxation electronic part, stress relaxation wiring board,...
- Patent number 6,465,082
- Issue date Oct 15, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for an electronic component and method for produ...
- Patent number 6,376,051
- Issue date Apr 23, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing electronic device with resin layer between...
- Patent number 6,372,547
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with a semiconductor...
- Patent number 6,372,548
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method of manufacturing and mounting the same
- Patent number 6,365,499
- Issue date Apr 2, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed-circuit board having projection electrodes and method for p...
- Patent number 6,300,576
- Issue date Oct 9, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier
- Patent number 6,229,209
- Issue date May 8, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating bump electrodes with a leveling step for uni...
- Patent number 6,207,550
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiro Hase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thixotropic conductive paste
- Patent number 5,688,441
- Issue date Nov 18, 1997
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multi-layered ceramic substrates
- Patent number 5,662,755
- Issue date Sep 2, 1997
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic substrate
- Patent number 5,547,530
- Issue date Aug 20, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and manufacturing method thereof
- Patent number 5,525,402
- Issue date Jun 11, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thixotropic conductive paste
- Patent number 5,503,777
- Issue date Apr 2, 1996
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly formed from conductive paste and insulating paste
- Patent number 5,496,619
- Issue date Mar 5, 1996
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ink
- Patent number 5,407,473
- Issue date Apr 18, 1995
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor composition and method of manufacturing a multilayered ce...
- Patent number 4,906,405
- Issue date Mar 6, 1990
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
PHOTO-SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20050042795
- Publication date Feb 24, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- G02 - OPTICS
Information Patent Application
Mounting structure for an electronic component and method for produ...
- Publication number 20030207073
- Publication date Nov 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for planarizing circuit board and method for manufacturing s...
- Publication number 20030092327
- Publication date May 15, 2003
- MINEHIRO ITAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photo-semiconductor module and method for manufacturing the same
- Publication number 20020098609
- Publication date Jul 25, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masahiro Ono
- G02 - OPTICS
Information Patent Application
Mounting structure for an electronic component and method for produ...
- Publication number 20020034620
- Publication date Mar 21, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE WITH A SEMICONDUCTOR...
- Publication number 20020017712
- Publication date Feb 14, 2002
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE, ITS MANUFACTURING METHOD, AND PRINTED WIRING BOAR...
- Publication number 20020008228
- Publication date Jan 24, 2002
- HIROAKI TAKEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER AND METHOD OF MANUFACTURING AND MOUNTING THE SAME
- Publication number 20020003299
- Publication date Jan 10, 2002
- YOSHIFUMI NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-circuit board having projection electrodes and method for p...
- Publication number 20010029666
- Publication date Oct 18, 2001
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLANARIZING CIRCUIT BOARD AND METHOD FOR MANUFACTURING S...
- Publication number 20010029066
- Publication date Oct 11, 2001
- MINEHIRO ITAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20010002733
- Publication date Jun 7, 2001
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS

Minehiro Itagaki

Person

Patents Grantslast 30 patents

Photo-semiconductor module and method for manufacturing the same

Photo-semiconductor module and method for manufacturing the same

Method for producing mounting structure for an electronic component

Method for planarizing circuit board and method for manufacturing s...

Method for planarizing circuit board and method for manufacturing s...

Method for producing a printed-circuit board having projection elec...

Mounting structure for an electronic component and method for produ...

Semiconductor device and method of manufacturing same

Conductive paste, its manufacturing method, and printed wiring boar...

Conductive composition, conductive adhesive, and their mounting str...

Stress relaxation electronic part, stress relaxation wiring board,...

Mounting structure for an electronic component and method for produ...

Method for manufacturing electronic device with resin layer between...

Method for fabricating a semiconductor package with a semiconductor...

Chip carrier and method of manufacturing and mounting the same

Printed-circuit board having projection electrodes and method for p...

Chip carrier

Method for fabricating bump electrodes with a leveling step for uni...

Thixotropic conductive paste

Method of making multi-layered ceramic substrates

Method of manufacturing a ceramic substrate

Ceramic substrate and manufacturing method thereof

Thixotropic conductive paste

Assembly formed from conductive paste and insulating paste

Conductive ink

Conductor composition and method of manufacturing a multilayered ce...

Patents Applicationslast 30 patents

PHOTO-SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

Mounting structure for an electronic component and method for produ...

Method for planarizing circuit board and method for manufacturing s...

Photo-semiconductor module and method for manufacturing the same

Mounting structure for an electronic component and method for produ...

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE WITH A SEMICONDUCTOR...

CONDUCTIVE PASTE, ITS MANUFACTURING METHOD, AND PRINTED WIRING BOAR...

CHIP CARRIER AND METHOD OF MANUFACTURING AND MOUNTING THE SAME

Printed-circuit board having projection electrodes and method for p...

METHOD FOR PLANARIZING CIRCUIT BOARD AND METHOD FOR MANUFACTURING S...

Semiconductor device and method of manufacturing same