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Mineyoshi Hasegawa
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Osaka, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Printed circuit board and method of manufacturing the same
Patent number
9,288,903
Issue date
Mar 15, 2016
Nitto Denko Corporation
Mineyoshi Hasegawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board and method of manufacturing the same
Patent number
8,822,834
Issue date
Sep 2, 2014
Nitto Denko Corporation
Shinichi Inoue
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing printed circuit board
Patent number
8,438,726
Issue date
May 14, 2013
Nitto Denko Corporation
Shinichi Inoue
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing double-sided printed circuit board
Patent number
7,281,327
Issue date
Oct 16, 2007
Nitto Denko Corporation
Yuichi Takayoshi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer wiring circuit board and method for producing the same
Patent number
6,902,949
Issue date
Jun 7, 2005
Nitto Denko Corporation
Hiroshi Yamazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer flexible wiring circuit board and its manufacturing method
Patent number
6,887,560
Issue date
May 3, 2005
Nitto Denko Corporation
Kei Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20120024581
Publication date
Feb 2, 2012
Nitto Denko Corporation
Mineyoshi HASEGAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20120024574
Publication date
Feb 2, 2012
Nitto Denko Corporation
Shinichi INOUE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
Publication number
20110277321
Publication date
Nov 17, 2011
Nitto Denko Corporation
Shinichi INOUE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD, FUEL CELL AND METHOD OF MANUFACTURING PRINTE...
Publication number
20110281202
Publication date
Nov 17, 2011
Nitto Denko Corporation
Hiroyuki HANAZONO
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method for manufacturing double-sided printed circuit board
Publication number
20060016072
Publication date
Jan 26, 2006
NITTO DENKO CORPORATION
Yuichi Takayoshi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of producing multilayer wired circuit board
Publication number
20050079652
Publication date
Apr 14, 2005
NITTO DENKO CORPORATION
Mineyoshi Hasegawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer flexible wiring circuit board and its manufacturing method
Publication number
20040035520
Publication date
Feb 26, 2004
Kei Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-layer wiring circuit board and method for producing the same
Publication number
20020140076
Publication date
Oct 3, 2002
NITTO DENKO CORPORATION
Hiroshi Yamazaki
H01 - BASIC ELECTRIC ELEMENTS