Ming -Ji Lii

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Sinpu Township, TW

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Patents Applicationslast 30 patents

Information Patent Application
BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240047397
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Structure with Reduced Peeling and Methods Forming the Same
- Publication number 20240034619
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY