Ming-Che Wu

Person

Tsao Tuen, TW

People

Patents Applicationslast 30 patents

Information Patent Application
Embedded package structure module with high-density electrical conn...
- Publication number 20100001295
- Publication date Jan 7, 2010
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR ARRANGING PRINT HEAD CHIPS
- Publication number 20090189949
- Publication date Jul 30, 2009
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Package structure module with high density electrical connections a...
- Publication number 20090184332
- Publication date Jul 23, 2009
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Multi-wavelength LED array package module and method for packaging...
- Publication number 20090166647
- Publication date Jul 2, 2009
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Multi-wavelength light-emitting module with high density electrical...
- Publication number 20090166648
- Publication date Jul 2, 2009
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LED array module and method of packaging the same
- Publication number 20090140268
- Publication date Jun 4, 2009
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of packaging an LED array module
- Publication number 20090107951
- Publication date Apr 30, 2009
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Multi-wavelength light-emitting module
- Publication number 20090079943
- Publication date Mar 26, 2009
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Ming-Che Wu

Person

Patents Applicationslast 30 patents

Embedded package structure module with high-density electrical conn...

METHOD FOR ARRANGING PRINT HEAD CHIPS

Package structure module with high density electrical connections a...

Multi-wavelength LED array package module and method for packaging...

Multi-wavelength light-emitting module with high density electrical...

LED array module and method of packaging the same

Method of packaging an LED array module

Multi-wavelength light-emitting module