Ming-Chen Lu

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level chip scale package structure and manufacturing method t...
- Patent number 11,062,969
- Issue date Jul 13, 2021
- Alpha and Omega Semiconductor (Cayman) LTD
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for built-in self-test of CDR and non-CDR comp...
- Patent number 10,641,823
- Issue date May 5, 2020
- PHOTONIC TECHNOLOGIES (SHANGHAI) CO., LTD.
- Ming Lu
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for spectral leakage removal in DAC testing
- Patent number 10,630,306
- Issue date Apr 21, 2020
- Advantest Corporation
- Ming Lu
- G01 - MEASURING TESTING
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 10,504,823
- Issue date Dec 10, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package structure and manufacturing method t...
- Patent number 10,242,926
- Issue date Mar 26, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast replacement Z-wave device in home automation
- Patent number 10,197,983
- Issue date Feb 5, 2019
- Honeywell International Inc.
- Ming Hong Lu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Hybrid packaged lead frame based multi-chip semiconductor device wi...
- Patent number 10,043,736
- Issue date Aug 7, 2018
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method of a thin power device
- Patent number 9,854,686
- Issue date Dec 26, 2017
- Alpha and Omega Semiconductor (Cayman) LTD
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,685,430
- Issue date Jun 20, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,679,833
- Issue date Jun 13, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thick bottom metal and preparation method...
- Patent number 9,653,383
- Issue date May 16, 2017
- Alpha & Omega Semiconductor (Cayman), Ltd.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 9,646,920
- Issue date May 9, 2017
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,472,491
- Issue date Oct 18, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 9,437,587
- Issue date Sep 6, 2016
- Alpha & Omega Semiconductor, Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of hybrid packaging a lead frame based multi-chip semiconduc...
- Patent number 9,425,181
- Issue date Aug 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vorticity-refinement based numerical method for simulating aircraft...
- Patent number 9,390,205
- Issue date Jul 12, 2016
- Xi'an Virtual-Dynamics Simulation Technology Inc.
- Ming Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Numerical method for solving an inverse problem in subsonic flows
- Patent number 9,384,169
- Issue date Jul 5, 2016
- Xi'an Virtual-Dynamics Simulation Technology Inc.
- Ming Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Topical compositions comprising fermented extracts of traditional m...
- Patent number 9,333,231
- Issue date May 10, 2016
- ELC Management LLC
- Jing Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Power semiconductor device and the preparation method
- Patent number 9,337,131
- Issue date May 10, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topical compositions comprising fermented extracts of traditional c...
- Patent number 9,327,004
- Issue date May 3, 2016
- ELC Management LLC
- Jing Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Embedded package and method thereof
- Patent number 9,269,699
- Issue date Feb 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-exposed semiconductor package and the manufacturing method
- Patent number 9,245,831
- Issue date Jan 26, 2016
- Alpha and Omega Semiconductor (Cayman) LTD
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topical compositions comprising fermented extracts of traditional C...
- Patent number 9,233,134
- Issue date Jan 12, 2016
- EL Management LLC
- Jing Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of making stacked multi-chip packaging structure
- Patent number 9,230,949
- Issue date Jan 5, 2016
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,171,788
- Issue date Oct 27, 2015
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thick bottom metal and preparation method...
- Patent number 9,087,828
- Issue date Jul 21, 2015
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid packaged lead frame based multi-chip semiconductor device wi...
- Patent number 9,054,091
- Issue date Jun 9, 2015
- Alpha & Omega Semiconductor, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip packaging structure and manufacturing method the...
- Patent number 9,006,870
- Issue date Apr 14, 2015
- Alpha and Omega Semiconductor Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin power device and preparation method thereof
- Patent number 9,006,901
- Issue date Apr 14, 2015
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip bottom source semiconductor device and preparati...
- Patent number 8,952,509
- Issue date Feb 10, 2015
- Alpha & Omega Semiconductor, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLI...
- Publication number 20240274688
- Publication date Aug 15, 2024
- Huawei Technologies Co., Ltd
- Zhili ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE P...
- Publication number 20230395455
- Publication date Dec 7, 2023
- Huawei Technologies Co., Ltd
- Shuiming LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBJECT TRACKING METHOD AND APPARATUS, STORAGE MEDIUM AND ELECTRONIC...
- Publication number 20210343027
- Publication date Nov 4, 2021
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Xiang Qi HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR BUILT-IN SELF-TEST
- Publication number 20200003830
- Publication date Jan 2, 2020
- PHOTONIC TECHNOLOGIES (SHANGHAI) CO., LTD.
- Ming Lu
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20190157174
- Publication date May 23, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20180005912
- Publication date Jan 4, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20170186675
- Publication date Jun 29, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAST REPLACEMENT Z-WAVE DEVICE IN HOME AUTOMATION
- Publication number 20170082997
- Publication date Mar 23, 2017
- Honeywell International Inc.
- Ming Hong Lu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD
- Publication number 20160379918
- Publication date Dec 29, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...
- Publication number 20160315039
- Publication date Oct 27, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NUMERICAL METHOD FOR SOLVING THE TWO-DIMENSIONAL RIEMANN PROBLEM TO...
- Publication number 20160306907
- Publication date Oct 20, 2016
- Ming LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED PACKAGE AND METHOD THEREOF
- Publication number 20160099238
- Publication date Apr 7, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD
- Publication number 20160093560
- Publication date Mar 31, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD
- Publication number 20160093559
- Publication date Mar 31, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20150357268
- Publication date Dec 10, 2015
- Alpha and Omega Semiconductor (Cayman), Ltd
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD THEREOF
- Publication number 20150325559
- Publication date Nov 12, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR SPECTRAL LEAKAGE REMOVAL IN DAC TESTING
- Publication number 20150323640
- Publication date Nov 12, 2015
- ADVANTEST (SINGAPORE) PTE LTD
- Ming Lu
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICK BOTTOM METAL AND PREPARATION METHOD...
- Publication number 20150279766
- Publication date Oct 1, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Hybrid Packaging a Lead Frame Based Multi-Chip Semiconduc...
- Publication number 20150236005
- Publication date Aug 20, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20150206868
- Publication date Jul 23, 2015
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARATION METHOD OF A THIN POWER DEVICE
- Publication number 20150189764
- Publication date Jul 2, 2015
- Alpha and Omega Semiconductor (Cayman), Ltd
- Yuping Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NUMERICAL METHOD FOR SOLVING AN INVERSE PROBLEM IN SUBSONIC FLOWS
- Publication number 20150186333
- Publication date Jul 2, 2015
- Ming LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MAKING STACKED MULTI-CHIP PACKAGING STRUCTURE
- Publication number 20150179626
- Publication date Jun 25, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Topical Compositions Comprising Fermented Extracts of Traditional C...
- Publication number 20150093457
- Publication date Apr 2, 2015
- Jing Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Topical Compositions Comprising Fermented Extracts of Traditional C...
- Publication number 20150093409
- Publication date Apr 2, 2015
- Jing Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Topical Compositions Comprising Fermented Extracts of Traditional C...
- Publication number 20150093461
- Publication date Apr 2, 2015
- JING CHENG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
STACKED MULTI - CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20150035129
- Publication date Feb 5, 2015
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN POWER DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20150021780
- Publication date Jan 22, 2015
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PACKAGING MULTI-CHIP SEMICONDUCTOR DEVICE AND PREPARATION ME...
- Publication number 20140361420
- Publication date Dec 11, 2014
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NUMERICAL METHOD TO SIMULATE COMPRESSIBLE VORTEX-DOMINATED FLOWS
- Publication number 20140350899
- Publication date Nov 27, 2014
- Ming LU
- G06 - COMPUTING CALCULATING COUNTING

Ming-Chen Lu

Person

Patents Grantslast 30 patents

Wafer level chip scale package structure and manufacturing method t...

Method and apparatus for built-in self-test of CDR and non-CDR comp...

Method and system for spectral leakage removal in DAC testing

Power semiconductor device with small contact footprint and the pre...

Wafer level chip scale package structure and manufacturing method t...

Fast replacement Z-wave device in home automation

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Preparation method of a thin power device

Embedded package and method thereof

Semiconductor package with small gate clip and assembly method

Semiconductor device with thick bottom metal and preparation method...

Power semiconductor device with small contact footprint and the pre...

Semiconductor package with small gate clip and assembly method

Flip chip semiconductor device

Method of hybrid packaging a lead frame based multi-chip semiconduc...

Vorticity-refinement based numerical method for simulating aircraft...

Numerical method for solving an inverse problem in subsonic flows

Topical compositions comprising fermented extracts of traditional m...

Power semiconductor device and the preparation method

Topical compositions comprising fermented extracts of traditional c...

Embedded package and method thereof

Top-exposed semiconductor package and the manufacturing method

Topical compositions comprising fermented extracts of traditional C...

Method of making stacked multi-chip packaging structure

Semiconductor package with small gate clip and assembly method

Semiconductor device with thick bottom metal and preparation method...

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Stacked multi-chip packaging structure and manufacturing method the...

Thin power device and preparation method thereof

Stacked multi-chip bottom source semiconductor device and preparati...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLI...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE P...

OBJECT TRACKING METHOD AND APPARATUS, STORAGE MEDIUM AND ELECTRONIC...

METHOD AND APPARATUS FOR BUILT-IN SELF-TEST

WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...

WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

FAST REPLACEMENT Z-WAVE DEVICE IN HOME AUTOMATION

SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD

Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...

NUMERICAL METHOD FOR SOLVING THE TWO-DIMENSIONAL RIEMANN PROBLEM TO...

EMBEDDED PACKAGE AND METHOD THEREOF

POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD

SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

EMBEDDED PACKAGE AND METHOD THEREOF

METHOD AND SYSTEM FOR SPECTRAL LEAKAGE REMOVAL IN DAC TESTING

SEMICONDUCTOR DEVICE WITH THICK BOTTOM METAL AND PREPARATION METHOD...

Method of Hybrid Packaging a Lead Frame Based Multi-Chip Semiconduc...

FLIP CHIP SEMICONDUCTOR DEVICE

PREPARATION METHOD OF A THIN POWER DEVICE

NUMERICAL METHOD FOR SOLVING AN INVERSE PROBLEM IN SUBSONIC FLOWS

METHOD OF MAKING STACKED MULTI-CHIP PACKAGING STRUCTURE

Topical Compositions Comprising Fermented Extracts of Traditional C...

Topical Compositions Comprising Fermented Extracts of Traditional C...

Topical Compositions Comprising Fermented Extracts of Traditional C...

STACKED MULTI - CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD T...

THIN POWER DEVICE AND PREPARATION METHOD THEREOF

HYBRID PACKAGING MULTI-CHIP SEMICONDUCTOR DEVICE AND PREPARATION ME...

NUMERICAL METHOD TO SIMULATE COMPRESSIBLE VORTEX-DOMINATED FLOWS