Ming-Cheng CHIU

Person

Fonghua Village, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit component with conductive terminals of different...
- Patent number 12,074,066
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,901,303
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating fin structure for fin field effect transistor
- Patent number 11,862,727
- Issue date Jan 2, 2024
- United Microelectronics Corp.
- Hao Che Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,854,993
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 11,804,475
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 11,594,520
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin structure for fin field effect transistor and method for fabric...
- Patent number 11,581,438
- Issue date Feb 14, 2023
- United Microelectronics Corp.
- Hao Che Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having integrated circuit component with conducti...
- Patent number 11,417,569
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,362,037
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 11,322,419
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 11,282,796
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adaptively adjusting amount of information in user inter...
- Patent number 10,969,948
- Issue date Apr 6, 2021
- National Tsing Hua University
- Ming-Chuan Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure with bump
- Patent number 10,879,185
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for wafer level packaging and manufacturing m...
- Patent number 10,879,201
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 10,811,389
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,790,235
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 10,770,402
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,756,038
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 10,734,299
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and related driving method utilizing common volta...
- Patent number 10,685,619
- Issue date Jun 16, 2020
- Himax Display, Inc.
- Yuet Wing Li
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated circuit component package and method of fabricating the...
- Patent number 10,636,757
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel driving apparatus and method for compensating pixel v...
- Patent number 10,573,266
- Issue date Feb 25, 2020
- Himax Technologies Limited
- Yih-Long Tseng
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package structure with bump
- Patent number 10,515,899
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 10,276,506
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,170,430
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 10,163,861
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 10,163,745
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,109,589
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking method
- Patent number 10,083,950
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Larry Jann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out structure and method of forming
- Patent number 10,068,844
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240363415
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING FIN STRUCTURE FOR FIN FIELD EFFECT TRANSISTOR
- Publication number 20230135072
- Publication date May 4, 2023
- United Microelectronics Corp.
- Hao Che Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE
- Publication number 20220359407
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20220319925
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE
- Publication number 20220278050
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Tilted Interface Between Device Die and Encapsulating...
- Publication number 20220238404
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN STRUCTURE FOR FIN FIELD EFFECT TRANSISTOR AND METHOD FOR FABRIC...
- Publication number 20220052199
- Publication date Feb 17, 2022
- United Microelectronics Corp.
- Hao Che Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BUMP
- Publication number 20210118804
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200388574
- Publication date Dec 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200381382
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE
- Publication number 20200373245
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Tilted Interface Between Device Die and Encapsulating...
- Publication number 20200365479
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273828
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOMIMETIC MICROTUBE AND PREPARATION METHOD THEREOF
- Publication number 20200248136
- Publication date Aug 6, 2020
- National Tsing-Hua University
- Fan-Gang Tseng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR ADAPTIVELY ADJUSTING AMOUNT OF INFORMATION IN USER INTER...
- Publication number 20200133468
- Publication date Apr 30, 2020
- National Tsing-Hua University
- Ming-Chuan Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE WITH BUMP
- Publication number 20200135651
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE
- Publication number 20190252323
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190131243
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package for Thermal Dissipation
- Publication number 20190131280
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Tilted Interface Between Device Die and Encapsulating...
- Publication number 20190122948
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20190088547
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT PACKAGE AND METHOD OF FABRICATING THE...
- Publication number 20190067226
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL DRIVING APPARATUS AND METHOD FOR COMPENSATING PIXEL V...
- Publication number 20190051261
- Publication date Feb 14, 2019
- HIMAX TECHNOLOGIES LIMITED
- Yih-Long Tseng
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY APPARATUS AND RELATED DRIVING METHOD UTILIZING COMMON VOLTA...
- Publication number 20180330691
- Publication date Nov 15, 2018
- HIMAX DISPLAY, INC.
- Yuet Wing LI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Production Management Method and System Using Power Consumption Fea...
- Publication number 20180299944
- Publication date Oct 18, 2018
- National Tsing Hua University
- Shu-Hao Liang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Package with Tilted Interface between Device Die and Encapsulating...
- Publication number 20180204780
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCT SERVICE SYSTEM CLASSIFICATION AND SERVICE TRANSF...
- Publication number 20180130124
- Publication date May 10, 2018
- National Tsing-Hua University
- Ming-Chuan Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20180096942
- Publication date Apr 5, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BUMP
- Publication number 20180096939
- Publication date Apr 5, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20180096943
- Publication date Apr 5, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Cheng CHIU

Person

Patents Grantslast 30 patents

Integrated circuit component with conductive terminals of different...

Integrated fan-out package

Method for fabricating fin structure for fin field effect transistor

Integrated fan-out package

Semiconductor package for thermal dissipation

Semiconductor package for thermal dissipation

Fin structure for fin field effect transistor and method for fabric...

Package structure having integrated circuit component with conducti...

Integrated fan-out package

Package with tilted interface between device die and encapsulating...

Integrated fan-out package and method of fabricating the same

Method for adaptively adjusting amount of information in user inter...

Package structure with bump

Semiconductor package for wafer level packaging and manufacturing m...

Semiconductor package for thermal dissipation

Integrated fan-out package and method of fabricating the same

Integrated fan-out package

Semiconductor package and manufacturing method thereof

Package with tilted interface between device die and encapsulating...

Display apparatus and related driving method utilizing common volta...

Integrated circuit component package and method of fabricating the...

Display panel driving apparatus and method for compensating pixel v...

Package structure with bump

Integrated fan-out package

Integrated fan-out package and method of fabricating the same

Semiconductor package for thermal dissipation

Package with tilted interface between device die and encapsulating...

Integrated fan-out package and method of fabricating the same

Die stacking method

Integrated fan-out structure and method of forming

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

METHOD FOR FABRICATING FIN STRUCTURE FOR FIN FIELD EFFECT TRANSISTOR

INTEGRATED FAN-OUT PACKAGE

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

INTEGRATED FAN-OUT PACKAGE

Package with Tilted Interface Between Device Die and Encapsulating...

FIN STRUCTURE FOR FIN FIELD EFFECT TRANSISTOR AND METHOD FOR FABRIC...

PACKAGE STRUCTURE WITH BUMP

INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGE

Package with Tilted Interface Between Device Die and Encapsulating...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

BIOMIMETIC MICROTUBE AND PREPARATION METHOD THEREOF

METHOD FOR ADAPTIVELY ADJUSTING AMOUNT OF INFORMATION IN USER INTER...

PACKAGE STRUCTURE WITH BUMP

INTEGRATED FAN-OUT PACKAGE

INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Package for Thermal Dissipation

Package with Tilted Interface Between Device Die and Encapsulating...

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

INTEGRATED CIRCUIT COMPONENT PACKAGE AND METHOD OF FABRICATING THE...

DISPLAY PANEL DRIVING APPARATUS AND METHOD FOR COMPENSATING PIXEL V...

DISPLAY APPARATUS AND RELATED DRIVING METHOD UTILIZING COMMON VOLTA...

Production Management Method and System Using Power Consumption Fea...

Package with Tilted Interface between Device Die and Encapsulating...

METHOD FOR PRODUCT SERVICE SYSTEM CLASSIFICATION AND SERVICE TRANSF...

INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE WITH BUMP

INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME