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Ming-Chi LIU

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  • Kaohsiung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package structure and method of manufacturing the same
    • Patent number 11,804,461
    • Issue date Oct 31, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Yu-Ping Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor packages
    • Patent number 10,867,899
    • Issue date Dec 15, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Yuan-Fu Sung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor packages
    • Patent number 10,141,252
    • Issue date Nov 27, 2018
    • Advanced Semiconductor Engineering, Inc.
    • Yuan-Fu Sung
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents