Ming-Chun Laio

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wire-bonding method and semiconductor package using the same
- Patent number 7,126,229
- Issue date Oct 24, 2006
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat dissipating structure
- Patent number 6,696,750
- Issue date Feb 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Cha-Yun Yin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire-bonding method and semiconductor package using the same
- Publication number 20070007669
- Publication date Jan 11, 2007
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method and semiconductor package using the same
- Publication number 20050173791
- Publication date Aug 11, 2005
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS