Ming-Hong Cha

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming same
- Patent number 11,075,173
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,673,161
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,397,059
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,123,788
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 8,829,673
- Issue date Sep 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20200135664
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20170271291
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20160329293
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20150371964
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20140377946
- Publication date Dec 25, 2014
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20140048929
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Hong Cha

Person

Patents Grantslast 30 patents

Bonded structures for package and substrate

Semiconductor device and method of forming same

Bonded structures for package and substrate

Bonded structures for package and substrate

Bonded structures for package and substrate

Bonded structures for package and substrate

Bonded structures for package and substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

Bonded Structures for Package and Substrate

Bonded Structures for Package and Substrate

Bonded Structures for Package and Substrate

Bonded Structures for Package and Substrate

Bonded Structures for Package and Substrate

Bonded Structures for Package and Substrate