Ming-Hsiao Ke

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board tape and joining method thereof
- Patent number 11,602,047
- Issue date Mar 7, 2023
- Chipbond Technology Corporation
- Yin-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate
- Patent number 9,247,635
- Issue date Jan 26, 2016
- Chipbond Technology Corporation
- Yi-Wen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD TAPE AND JOINING METHOD THEREOF
- Publication number 20220087017
- Publication date Mar 17, 2022
- Chipbond Technology Corporation
- Yin-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE
- Publication number 20150359085
- Publication date Dec 10, 2015
- Chipbond Technology Corporation
- Yi-Wen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR