Ming-Hsin Thomas Chen

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing integrated circuit having through-substrate...
- Patent number 12,223,250
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,224,257
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probiotic compositions and uses thereof
- Patent number 12,220,436
- Issue date Feb 11, 2025
- NATIONAL TAIWAN UNIVERSITY
- Ming-Ju Chen
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Grant
Three-dimensional stacking structure and manufacturing method thereof
- Patent number 12,224,265
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,218,108
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,210,187
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shared barrier layer in redistribution a...
- Patent number 12,211,823
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming thereof
- Patent number 12,211,707
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,205,911
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial isolator
- Patent number 12,206,151
- Issue date Jan 21, 2025
- EZconn Corporation
- Ming-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens assembly
- Patent number 12,196,934
- Issue date Jan 14, 2025
- Sintai Optical (Shenzhen) Co., Ltd.
- Ming-Chung Chen
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source generation apparatus, light source generating method,...
- Patent number 12,191,621
- Issue date Jan 7, 2025
- National Tsing Hua University
- Andrew Hing Cheong Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of three-dimensional stacking structure
- Patent number 12,191,283
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,185,475
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching Pi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fluid immersion cooling system with low flash point hydrocarbon die...
- Patent number 12,185,497
- Issue date Dec 31, 2024
- Super Micro Computer, Inc.
- Yueh-Ming Liu
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Process control for package formation
- Patent number 12,183,728
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structure
- Patent number 12,176,344
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
- Patent number 12,176,257
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with photonic die and method
- Patent number 12,176,270
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,170,327
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having different metal densities in different regions and m...
- Patent number 12,165,971
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for aligned stitching
- Patent number 12,154,862
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,154,875
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062289
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250044510
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250046738
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250044530
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
ANTENNA STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20250047003
- Publication date Feb 6, 2025
- WISTRON NEWEB CORPORATION
- Ming-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250040254
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Current Sensing Calibration Method and Current Sensing Calibration...
- Publication number 20250035730
- Publication date Jan 30, 2025
- HIMAX TECHNOLOGIES LIMITED
- Te-Chieh Kung
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL CONNECTOR WITH IMPROVED SHIELDING PLATE DEFINING GROUNDI...
- Publication number 20250030200
- Publication date Jan 23, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- MING-CHING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20250030203
- Publication date Jan 23, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- MING-CHING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022991
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE DISPLACEMENT DEVICE
- Publication number 20250013119
- Publication date Jan 9, 2025
- YOUNG OPTICS INC.
- Ming-Chih CHEN
- G02 - OPTICS
Information Patent Application
Pixel Structures in Image Sensors
- Publication number 20250006762
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPH...
- Publication number 20250008635
- Publication date Jan 2, 2025
- MING CHI UNIVERSITY OF TECHNOLOGY
- Jhih-Yan HE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LITHOGRAPHY SYSTEM AND METHODS
- Publication number 20240419082
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsin CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20240396270
- Publication date Nov 28, 2024
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- MING-CHING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20240395751
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240395752
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20240396269
- Publication date Nov 28, 2024
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO, LTD.
- MING-CHING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387391
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF
- Publication number 20240387491
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240385395
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240387434
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387468
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387377
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20240387734
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chandrashekhar Prakash SAVANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LINER TSV STRUCTURE AND METHOD FORMING SAME
- Publication number 20240379521
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Hsin Thomas Chen

Person

Patents Grantslast 30 patents

Method of manufacturing integrated circuit having through-substrate...

Semiconductor structure and manufacturing method thereof

Probiotic compositions and uses thereof

Three-dimensional stacking structure and manufacturing method thereof

Bonding to alignment marks with dummy alignment marks

Semiconductor die connection system and method

Package and method of forming the same

Package and manufacturing method thereof

Package structure for heat dissipation

Semiconductor structure

Semiconductor package with shared barrier layer in redistribution a...

Integrated circuit package and method of forming thereof

Bonding structure and method of forming same

Coaxial isolator

Lens assembly

Semiconductor device and method of manufacture

Light source generation apparatus, light source generating method,...

Manufacturing method of three-dimensional stacking structure

Electronic device and method of manufacturing the same

Fluid immersion cooling system with low flash point hydrocarbon die...

Process control for package formation

Methods of forming semiconductor structure

Semiconductor structure having an anti-arcing pattern disposed on a...

Package structure with photonic die and method

Semiconductor structure and manufacturing method of the same

Integrated circuit packages and methods of forming the same

Package having different metal densities in different regions and m...

Manufacturing method of package

System and method for aligned stitching

Package and method of fabricating the same

Patents Applicationslast 30 patents

PACKAGE AND MANUFACTURING METHOD THEREOF

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE AND METHOD OF FABRICATING THE SAME

OPTICAL DEVICE AND METHOD OF MANUFACTURE

ANTENNA STRUCTURE AND ELECTRONIC DEVICE

PACKAGE STRUCTURES

Current Sensing Calibration Method and Current Sensing Calibration...

ELECTRICAL CONNECTOR WITH IMPROVED SHIELDING PLATE DEFINING GROUNDI...

ELECTRICAL CONNECTOR

SEMICONDUCTOR PACKAGE

IMAGE DISPLACEMENT DEVICE

Pixel Structures in Image Sensors

CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPH...

LITHOGRAPHY SYSTEM AND METHODS

ELECTRICAL CONNECTOR

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

BONDING STRUCTURE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

ELECTRICAL CONNECTOR

Semiconductor Devices and Methods of Manufacture

DIE ON DIE BONDING STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

OPTICAL DEVICE AND METHOD OF MANUFACTURE

PACKAGE STRUCTURE

PACKAGE AND METHOD OF FABRICATING THE SAME

Method for Forming a Semiconductor Device Having TSV Formed Through...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

MULTI-LINER TSV STRUCTURE AND METHOD FORMING SAME