Ming-Hsin Thomas Chen

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure having photonic die and electronic die
- Patent number 12,368,147
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial connector with a movable terminal assembly
- Patent number 12,368,258
- Issue date Jul 22, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Ming-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EUV photo masks and manufacturing method thereof
- Patent number 12,366,797
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Tsai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator and its electronic subassembly
- Patent number 12,363,848
- Issue date Jul 15, 2025
- EZconn Corporation
- Li Chan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,362,342
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform and see-through display having lens displaying content on...
- Patent number 12,360,726
- Issue date Jul 15, 2025
- Liqxtal Technology Inc.
- Hung-Shan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,364,008
- Issue date Jul 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle of protecting from particle attacks
- Patent number 12,353,143
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Tang Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods of fabricating package structure
- Patent number 12,355,008
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, optical device, and manufacturing method of package
- Patent number 12,353,008
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- G02 - OPTICS
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,355,007
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly having a metal plate for mounting a c...
- Patent number 12,347,963
- Issue date Jul 1, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Ming-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical infrared sensing device and fabrication meth...
- Patent number 12,345,571
- Issue date Jul 1, 2025
- Industrial Technology Research Institute
- Chin-Jou Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of making a semiconductor device
- Patent number 12,346,027
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Cheng Hsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Control circuit of atmospheric plasma generating device and atmosph...
- Patent number 12,349,264
- Issue date Jul 1, 2025
- Ming Chi University of Technology
- Jhih-Yan He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Training method for semiconductor process prediction model, semicon...
- Patent number 12,339,632
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Chia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits
- Patent number 12,334,459
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test socket connector having latch with a bottom guiding portion
- Patent number 12,326,461
- Issue date Jun 10, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Ming-Yue Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,315,842
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,317,655
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 12,317,567
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 12,308,323
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising electron blocking layer
- Patent number 12,300,764
- Issue date May 13, 2025
- Epistar Corporation
- Chia-Ming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package structure comprising package unit incl...
- Patent number 12,300,630
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless bonding layers in semiconductor packages and methods of fo...
- Patent number 12,300,639
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate stack treatment
- Patent number 12,300,549
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GATE STACK TREATMENT
- Publication number 20250241055
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIC PHOTOINITIATOR, PREPARATION METHOD THEREOF AND PHOTOCURAB...
- Publication number 20250236701
- Publication date Jul 24, 2025
- COVESTRO (TAIWAN) LTD.
- Wen-Hsien WEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOINITIATOR AND CURABLE COMPOSITION COMPRISING THE SAME
- Publication number 20250236811
- Publication date Jul 24, 2025
- COVESTRO (TAIWAN) LTD.
- Wen-Hsien WEN
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
See-through display, electrical controlling eyewear and system thereof
- Publication number 20250231405
- Publication date Jul 17, 2025
- LIQXTAL TECHNOLOGY INC.
- Hung-Shan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR
- Publication number 20250227942
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250219023
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVERSATIONAL MEDIATOR SYSTEM AND METHOD FOR INTERACTING WITH CONV...
- Publication number 20250217599
- Publication date Jul 3, 2025
- MEDIATEK INC.
- Ming-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218978
- Publication date Jul 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Hui-Ping JIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250208363
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zi-Jheng Liu
- G02 - OPTICS
Information Patent Application
ELECTRODE MATERIAL, ELECTRODE, BATTERY AND METHOD FOR FORMING THE E...
- Publication number 20250210665
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Tsung-Hsiung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210465
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATER-COOLING PLATE AND MANUFACTURING METHOD OF WATER-COOLING PLATE...
- Publication number 20250207870
- Publication date Jun 26, 2025
- Ming-Hung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250204098
- Publication date Jun 19, 2025
- AUO Corporation
- Jia Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20250201648
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACK STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201777
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL SOCKET WITH AN IMPROVED ELEVATING MECHANISM FOR A HEATIN...
- Publication number 20250189558
- Publication date Jun 12, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- MING-YUE CHEN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183110
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION
- Publication number 20250183192
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SYSTEM WITH REMOVABLE FIBER ARRAY UNIT ASSEMBLY AND METHOD...
- Publication number 20250172774
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih LIN
- G02 - OPTICS
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250164714
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF THREE-DIMENSIONAL STACKING STRUCTURE
- Publication number 20250157984
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250149513
- Publication date May 8, 2025
- AUO Corporation
- Ming-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250151460
- Publication date May 8, 2025
- EPISTAR CORPORATION
- Yung-Chung PAN
Information Patent Application
BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
- Publication number 20250149500
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140721
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Hsin Thomas Chen

Person

Patents Grantslast 30 patents

Semiconductor structure having photonic die and electronic die

Coaxial connector with a movable terminal assembly

EUV photo masks and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of manufacture

Semiconductor package and method of manufacturing semiconductor pac...

Isolator and its electronic subassembly

Semiconductor package

Platform and see-through display having lens displaying content on...

Semiconductor device package and method of manufacturing the same

Reticle of protecting from particle attacks

Methods of fabricating package structure

Package, optical device, and manufacturing method of package

Package and method of fabricating the same

Electrical connector assembly having a metal plate for mounting a c...

Microelectromechanical infrared sensing device and fabrication meth...

Methods of making a semiconductor device

Control circuit of atmospheric plasma generating device and atmosph...

Training method for semiconductor process prediction model, semicon...

Integrated circuits

Test socket connector having latch with a bottom guiding portion

Package structure

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device structure and method for forming the same

Semiconductor die, manufacturing method thereof, and semiconductor...

Package-on-package device

Semiconductor device comprising electron blocking layer

Semiconductor device package structure comprising package unit incl...

Seamless bonding layers in semiconductor packages and methods of fo...

Gate stack treatment

Patents Applicationslast 30 patents

GATE STACK TREATMENT

POLYMERIC PHOTOINITIATOR, PREPARATION METHOD THEREOF AND PHOTOCURAB...

SEMICONDUCTOR PACKAGES

PHOTOINITIATOR AND CURABLE COMPOSITION COMPRISING THE SAME

See-through display, electrical controlling eyewear and system thereof

STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CONVERSATIONAL MEDIATOR SYSTEM AND METHOD FOR INTERACTING WITH CONV...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTICAL DEVICES AND METHODS OF MANUFACTURE

ELECTRODE MATERIAL, ELECTRODE, BATTERY AND METHOD FOR FORMING THE E...

PACKAGE AND MANUFACTURING METHOD THEREOF

WATER-COOLING PLATE AND MANUFACTURING METHOD OF WATER-COOLING PLATE...

DISPLAY APPARATUS

INTEGRATED CIRCUIT PACKAGES

DIE STACK STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRICAL SOCKET WITH AN IMPROVED ELEVATING MECHANISM FOR A HEATIN...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION

Semiconductor Die Connection System and Method

PHOTONIC SYSTEM WITH REMOVABLE FIBER ARRAY UNIT ASSEMBLY AND METHOD...

PACKAGES FORMED USING RDL-LAST PROCESS

OPTICAL DEVICE AND METHOD OF MANUFACTURE

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

PACKAGE STRUCTURE FOR HEAT DISSIPATION

MANUFACTURING METHOD OF THREE-DIMENSIONAL STACKING STRUCTURE

DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE

BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF