Ming-Hsing Chung

Person

Taoyuan Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 12,087,732
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structure and method forming same
- Patent number 12,074,064
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with vertically stacked and laterally offset...
- Patent number 12,066,671
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Grant
Power supply health check system and method thereof
- Patent number 12,026,075
- Issue date Jul 2, 2024
- ASUSTeK COMPUTER Inc.
- Cheng-Wei Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photonic waveguide and method of forming the same
- Patent number 11,994,717
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming Yang Chung
- G02 - OPTICS
Information Patent Grant
Light receiving and emitting device
- Patent number 11,892,692
- Issue date Feb 6, 2024
- CLOUD LIGHT TECHNOLOGY LIMITED
- Cheng-Kai Huang
- G02 - OPTICS
Information Patent Grant
Heterogeneous dielectric bonding scheme
- Patent number 11,869,869
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etchant composition, tackifier, alkaline solution, method of removi...
- Patent number 11,851,597
- Issue date Dec 26, 2023
- ECHEM SOLUTIONS CORP.
- Yu-Ning Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of forming semiconductor device having backside interconnect...
- Patent number 11,823,979
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon etching solution, silicon etching method, and method of pro...
- Patent number 11,802,240
- Issue date Oct 31, 2023
- Tokyo Ohka Kogyo Co., Ltd.
- Ming-Yen Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 11,721,666
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with dielectric spacer liner on source/drain c...
- Patent number 11,670,690
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Cheng Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming patterned polyimide layer
- Patent number 11,609,496
- Issue date Mar 21, 2023
- ECHEM SOLUTIONS CORP.
- Ting-Wei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
TSV structure and method forming same
- Patent number 11,527,439
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power switching device and image processing device with power switc...
- Patent number 11,516,364
- Issue date Nov 29, 2022
- Hong Fu Jin Precision Industry (WuHan) Co., Ltd.
- Ming-Hung Chung
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Waterproof device
- Patent number 11,495,951
- Issue date Nov 8, 2022
- Pegatron Corporation
- Ming-Ju Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for grading a memory
- Patent number 11,488,679
- Issue date Nov 1, 2022
- TEAM GROUP INC.
- Hsi-Lin Kuo
- G11 - INFORMATION STORAGE
Information Patent Grant
Wireless data transmitting device, wireless data transmitting syste...
- Patent number 11,419,158
- Issue date Aug 16, 2022
- Mars Semiconductor Corp
- Ming Liang Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Additive manufacturing method and object manufactured thereby
- Patent number 11,390,019
- Issue date Jul 19, 2022
- TECO IMAGE SYSTEMS CO., LTD
- Ming-Chieh Chung
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silicon etching solution, silicon etching method, and method of pro...
- Patent number 11,306,248
- Issue date Apr 19, 2022
- Tokyo Ohka Kogyo Co., Ltd.
- Ming-Yen Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Case structure
- Patent number 11,228,334
- Issue date Jan 18, 2022
- Pegatron Corporation
- Tsu-Hsuan Huang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Power switching device and image processing device with power switc...
- Patent number 11,223,740
- Issue date Jan 11, 2022
- Hong Fu Jin Precision Industry (WuHan) Co., Ltd.
- Ming-Hung Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wireless data communication system and method
- Patent number 11,218,255
- Issue date Jan 4, 2022
- Mars Semiconductor Corp
- Ming-Liang Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 11,101,240
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 11,056,419
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating tantalum nitride barrier layer and semiconduc...
- Patent number 11,043,573
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Cheng Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive polyimide composition and photoresist film made thereof
- Patent number 11,029,598
- Issue date Jun 8, 2021
- ECHEM SOLUTIONS CORP.
- Tz Jin Yang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 11,004,741
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roller structure
- Patent number 10,994,957
- Issue date May 4, 2021
- TECO IMAGE SYSTEMS CO., LTD
- Ting-Chun Chen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wired optical communication assembly having first and second arraye...
- Patent number 10,948,673
- Issue date Mar 16, 2021
- Prime World International Holdings Ltd.
- Ming-Hsing Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME
- Publication number 20250070045
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Implantation
- Publication number 20250062136
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062204
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Modulation Through Implantation and the Structures Thereof
- Publication number 20250062247
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Chih Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE THAT IMPROVES WIRELESS NETWORK TRANSMISSION QUALI...
- Publication number 20250039764
- Publication date Jan 30, 2025
- ASUSTEK COMPUTER INC.
- Jui-Ting CHUANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Bond Features For Reducing Non-Bond and Methods of Forming the Same
- Publication number 20250006677
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD
- Publication number 20240392463
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan Nian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES
- Publication number 20240387379
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS DIELECTRIC BONDING SCHEME
- Publication number 20240387449
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Films for Reduced Thermal Resistance and Methods Forming the Same
- Publication number 20240379505
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIVE PHOTORESIST COMPOSITION, NEGATIVE PHOTORESIST PATTERN LITH...
- Publication number 20240369927
- Publication date Nov 7, 2024
- Advanced Echem Materials Company Limited
- Kuo Chu Yeh
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES
- Publication number 20240369785
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Application
TSV STRUCTURE AND METHOD FORMING SAME
- Publication number 20240363411
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stealth Patterning Formation for Bonding Improvement
- Publication number 20240363359
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INCLUDING A BUFFER LAYER AND METHODS OF FORMATION
- Publication number 20240355870
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240321694
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHY SYSTEM AND METHOD OF DETECTING FLUID LEAKAGE IN LIQUID...
- Publication number 20240319611
- Publication date Sep 26, 2024
- United Microelectronics Corp.
- Zhi Fan Sun
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240312836
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Semiconductor Dies Through Wafer Bonding Processes
- Publication number 20240312952
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC WAVEGUIDE AND METHOD OF FORMING THE SAME
- Publication number 20240272358
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING YANG CHUNG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240258100
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Dielectric Bonding Scheme
- Publication number 20240096847
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230402320
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN-NAN NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thr...
- Publication number 20230386976
- Publication date Nov 30, 2023
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY HEALTH CHECK SYSTEM AND METHOD THEREOF
- Publication number 20230350772
- Publication date Nov 2, 2023
- ASUSTEK COMPUTER INC.
- Cheng-Wei GU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Isolation Bonding Film for Semiconductor Packages and Methods of Fo...
- Publication number 20230343747
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC WAVEGUIDE AND METHOD OF FORMING THE SAME
- Publication number 20230324609
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- MING YANG CHUNG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DIELECTRIC SPACER LINER ON SOURCE/DRAIN C...
- Publication number 20230268402
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Cheng HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES
- Publication number 20230221511
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20230215802
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Hsing Chung

Person

Patents Grantslast 30 patents

Isolation bonding film for semiconductor packages and methods of fo...

TSV structure and method forming same

Semiconductor devices with vertically stacked and laterally offset...

Power supply health check system and method thereof

Photonic waveguide and method of forming the same

Light receiving and emitting device

Heterogeneous dielectric bonding scheme

Etchant composition, tackifier, alkaline solution, method of removi...

Method of forming semiconductor device having backside interconnect...

Silicon etching solution, silicon etching method, and method of pro...

Isolation bonding film for semiconductor packages and methods of fo...

Semiconductor device with dielectric spacer liner on source/drain c...

Method of forming patterned polyimide layer

TSV structure and method forming same

Power switching device and image processing device with power switc...

Waterproof device

Method for grading a memory

Wireless data transmitting device, wireless data transmitting syste...

Additive manufacturing method and object manufactured thereby

Silicon etching solution, silicon etching method, and method of pro...

Case structure

Power switching device and image processing device with power switc...

Wireless data communication system and method

Isolation bonding film for semiconductor packages and methods of fo...

Semiconductor device having backside interconnect structure on thro...

Method of fabricating tantalum nitride barrier layer and semiconduc...

Photosensitive polyimide composition and photoresist film made thereof

Profile of through via protrusion in 3DIC interconnect

Roller structure

Wired optical communication assembly having first and second arraye...

Patents Applicationslast 30 patents

PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME

Packages with Implantation

INTEGRATED CIRCUIT PACKAGE AND METHOD

Warpage Modulation Through Implantation and the Structures Thereof

ELECTRONIC DEVICE THAT IMPROVES WIRELESS NETWORK TRANSMISSION QUALI...

Bond Features For Reducing Non-Bond and Methods of Forming the Same

SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD

METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES

HETEROGENEOUS DIELECTRIC BONDING SCHEME

Bond Films for Reduced Thermal Resistance and Methods Forming the Same

POSITIVE PHOTORESIST COMPOSITION, NEGATIVE PHOTORESIST PATTERN LITH...

SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES

TSV STRUCTURE AND METHOD FORMING SAME

Stealth Patterning Formation for Bonding Improvement

CAPACITOR STRUCTURE INCLUDING A BUFFER LAYER AND METHODS OF FORMATION

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

LITHOGRAPHY SYSTEM AND METHOD OF DETECTING FLUID LEAKAGE IN LIQUID...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Bonding Semiconductor Dies Through Wafer Bonding Processes

PHOTONIC WAVEGUIDE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Heterogeneous Dielectric Bonding Scheme

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Device Having Backside Interconnect Structure on Thr...

POWER SUPPLY HEALTH CHECK SYSTEM AND METHOD THEREOF

Isolation Bonding Film for Semiconductor Packages and Methods of Fo...

PHOTONIC WAVEGUIDE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH DIELECTRIC SPACER LINER ON SOURCE/DRAIN C...

SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES

CONDUCTIVE STRUCTURES AND METHODS OF FABRICATION THEREOF