Ming-Jen HSIUNG

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Zhubei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level chip-size package with redistribution layer
- Patent number 10,998,267
- Issue date May 4, 2021
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device using the same and manu...
- Patent number 10,242,927
- Issue date Mar 26, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package with redistribution layer
- Patent number 9,953,954
- Issue date Apr 24, 2018
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL CHIP-SIZE PACKAGE WITH REDISTRIBUTION LAYER
- Publication number 20170263523
- Publication date Sep 14, 2017
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANU...
- Publication number 20170194227
- Publication date Jul 6, 2017
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER
- Publication number 20170162540
- Publication date Jun 8, 2017
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS