Ming-Kun Cheng

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 12,272,664
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security mechanism for connection establishment over multi-hop side...
- Patent number 12,267,895
- Issue date Apr 1, 2025
- MediaTek Singapore Pte Ltd.
- Nathan Edward Tenny
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor between two passivation layers with different etching rates
- Patent number 12,255,131
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,243,837
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,237,320
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and server for handling streaming data
- Patent number 12,231,700
- Issue date Feb 18, 2025
- 17LIVE JAPAN INC.
- YungChi Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Metal bumps and method forming same
- Patent number 12,230,595
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arched membrane structure for MEMS device
- Patent number 12,209,013
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for exchanging data and non-transitory computer-readable med...
- Patent number 12,212,674
- Issue date Jan 28, 2025
- LNDATA, INC.
- Ming-Chieh Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with tunable channel layer usage and methods o...
- Patent number 12,191,370
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing assembly
- Patent number 12,192,633
- Issue date Jan 7, 2025
- Aver Information Inc.
- Ming-Te Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatuses and methods for SideLink (SL) communication in a User E...
- Patent number 12,193,088
- Issue date Jan 7, 2025
- MediaTek Singapore Pte Ltd.
- Nathan Edward Tenny
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dielectric fins with air gap and backside self-aligned contact
- Patent number 12,166,071
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial sensing enhancement for sidelink resource allocation
- Patent number 12,156,176
- Issue date Nov 26, 2024
- MediaTek Singapore Pte Ltd.
- Tao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device structure
- Patent number 12,154,946
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Shuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,142,668
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 12,136,644
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arched membrane structure for MEMS device
- Patent number 12,134,557
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relay selection and reselection
- Patent number 12,108,299
- Issue date Oct 1, 2024
- Mediatek Inc.
- Ming-Yuan Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,068,303
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE
- Publication number 20250112084
- Publication date Apr 3, 2025
- CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
- Te-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER GENERATION COMPLEMENTARY SYSTEM FOR TIDAL RANGE POWER GENERAT...
- Publication number 20250084821
- Publication date Mar 13, 2025
- Ming-Feng Cheng
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MULTIPLE EXECUTABLE BINARIES WITH STATIC LINKS
- Publication number 20250053384
- Publication date Feb 13, 2025
- MEDIATEK INC.
- Wei-Chun KAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...
- Publication number 20250038008
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsiang Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SEMICONDU...
- Publication number 20250040201
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Shuan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Battery Module, Battery Device, and Battery System Having Thermal M...
- Publication number 20240429488
- Publication date Dec 26, 2024
- Yun Energy Limited Company
- MING YAO CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures with Compact Copper Conductive Features
- Publication number 20240387604
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE
- Publication number 20240383744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME
- Publication number 20240387433
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240387430
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FINS WITH AIR GAP AND BACKSIDE SELF-ALIGNED CONTACT
- Publication number 20240379744
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20240379589
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices with Air Gaps and the Method Thereof
- Publication number 20240379813
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Channel Devices and Method with Anti-Punch Through Process
- Publication number 20240379816
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR TUNING VIA PROFILE IN DIELECTRIC MATERIAL
- Publication number 20240371915
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...
- Publication number 20240363461
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsieh-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240363569
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240355692
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALF REST AND SUPPORT STRUCTURE OF WHEELCHAIR
- Publication number 20240350336
- Publication date Oct 24, 2024
- MERITS HEALTH PRODUCTS CO., LTD.
- Ming-Chuan Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BEAM MANAGEMENT OF SL FR2
- Publication number 20240340066
- Publication date Oct 10, 2024
- MEDIATEK SINGAPORE PTE LTD
- Chenmeng Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240332235
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...
- Publication number 20240332220
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME
- Publication number 20240321621
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang HU
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Kun Cheng

Person

Patents Grantslast 30 patents

Semiconductor packages having conductive pillars with inclined surf...

Security mechanism for connection establishment over multi-hop side...

Semiconductor package structure comprising via structure and redist...

Capacitor between two passivation layers with different etching rates

Semiconductor device and method

Package structure and method of forming the same

Method and server for handling streaming data

Metal bumps and method forming same

Package structure with warpage-control element

Arched membrane structure for MEMS device

Method for exchanging data and non-transitory computer-readable med...

Semiconductor device with tunable channel layer usage and methods o...

Image capturing assembly

Apparatuses and methods for SideLink (SL) communication in a User E...

Dielectric fins with air gap and backside self-aligned contact

Partial sensing enhancement for sidelink resource allocation

Semiconductor device structure

Semiconductor device and method

Organic interposer including a dual-layer inductor structure and me...

Tools and systems for processing semiconductor devices, and methods...

Warpage control in the packaging of integrated circuits

Process for tuning via profile in dielectric material

Arched membrane structure for MEMS device

Package structure with fan-out feature

Semiconductor bonding structures and methods

Method of manufacturing semiconductor structure

Relay selection and reselection

Method of forming semiconductor packages having through package vias

Formation method of chip package with fan-out structure

Package structure

Patents Applicationslast 30 patents

MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE

POWER GENERATION COMPLEMENTARY SYSTEM FOR TIDAL RANGE POWER GENERAT...

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

METHOD AND DEVICE FOR MULTIPLE EXECUTABLE BINARIES WITH STATIC LINKS

METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SEMICONDU...

Battery Module, Battery Device, and Battery System Having Thermal M...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

Semiconductor Structures with Compact Copper Conductive Features

ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE

REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME

METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME

DIELECTRIC FINS WITH AIR GAP AND BACKSIDE SELF-ALIGNED CONTACT

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

Semiconductor Devices with Air Gaps and the Method Thereof

Multi-Channel Devices and Method with Anti-Punch Through Process

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

PROCESS FOR TUNING VIA PROFILE IN DIELECTRIC MATERIAL

Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...

BUMP INTEGRATION WITH REDISTRIBUTION LAYER

SEMICONDUCTOR PACKAGE STRUCTURE

CALF REST AND SUPPORT STRUCTURE OF WHEELCHAIR

BEAM MANAGEMENT OF SL FR2

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...

FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME