Ming-Kun Cheng

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,368,120
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-acoustical transducer device
- Patent number 12,369,000
- Issue date Jul 22, 2025
- Transducer Star Technology INC.
- Yu-Chen Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Modem performance enhancement via smart transmission power distribu...
- Patent number 12,356,342
- Issue date Jul 8, 2025
- Mediatek Inc.
- Chih-Chieh Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of logical channel prioritization to support sidelink relay
- Patent number 12,349,186
- Issue date Jul 1, 2025
- Mediatek Inc.
- Guan-Yu Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor devices with air gaps and the method thereof
- Patent number 12,324,218
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding pads and methods of forming the same
- Patent number 12,300,644
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 12,300,652
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,300,580
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and methods of manufac...
- Patent number 12,288,730
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel devices and method with anti-punch through process
- Patent number 12,278,276
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 12,272,664
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security mechanism for connection establishment over multi-hop side...
- Patent number 12,267,895
- Issue date Apr 1, 2025
- MediaTek Singapore Pte Ltd.
- Nathan Edward Tenny
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor between two passivation layers with different etching rates
- Patent number 12,255,131
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,243,837
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,237,320
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and server for handling streaming data
- Patent number 12,231,700
- Issue date Feb 18, 2025
- 17LIVE JAPAN INC.
- YungChi Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Metal bumps and method forming same
- Patent number 12,230,595
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arched membrane structure for MEMS device
- Patent number 12,209,013
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for exchanging data and non-transitory computer-readable med...
- Patent number 12,212,674
- Issue date Jan 28, 2025
- LNDATA, INC.
- Ming-Chieh Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with tunable channel layer usage and methods o...
- Patent number 12,191,370
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing assembly
- Patent number 12,192,633
- Issue date Jan 7, 2025
- Aver Information Inc.
- Ming-Te Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatuses and methods for SideLink (SL) communication in a User E...
- Patent number 12,193,088
- Issue date Jan 7, 2025
- MediaTek Singapore Pte Ltd.
- Nathan Edward Tenny
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dielectric fins with air gap and backside self-aligned contact
- Patent number 12,166,071
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial sensing enhancement for sidelink resource allocation
- Patent number 12,156,176
- Issue date Nov 26, 2024
- MediaTek Singapore Pte Ltd.
- Tao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device structure
- Patent number 12,154,946
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Shuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,142,668
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...
- Publication number 20250210437
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20250201750
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250192087
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES
- Publication number 20250183153
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250183204
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Tunable Channel Layer Usage And Methods O...
- Publication number 20250176215
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu Lai
Information Patent Application
METHOD AND SERVER FOR HANDLING STREAMING DATA
- Publication number 20250168415
- Publication date May 22, 2025
- 17LIVE Japan Inc.
- YungChi HSU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IDENTIFICATION METHOD AND IDENTIFICATION SYSTEM FOR LICENSE PLATE
- Publication number 20250157229
- Publication date May 15, 2025
- GETAC TECHNOLOGY CORPORATION
- Ming-Che Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMPS AND METHOD FORMING SAME
- Publication number 20250149485
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250149380
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EDGE-COMPUTING METHOD FOR AUTOMATIC LICENSE PLATE RECOGNITION AND S...
- Publication number 20250139997
- Publication date May 1, 2025
- GETAC TECHNOLOGY CORPORATION
- Ming-Che Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR TRACKING OBJECT IN DYNAMIC SCENE AND SYSTEM THEREOF
- Publication number 20250139998
- Publication date May 1, 2025
- GETAC TECHNOLOGY CORPORATION
- Chih-Hao Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20250118615
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250118697
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE
- Publication number 20250112084
- Publication date Apr 3, 2025
- CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
- Te-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY INDUCTOR
- Publication number 20250105142
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Bo-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER GENERATION COMPLEMENTARY SYSTEM FOR TIDAL RANGE POWER GENERAT...
- Publication number 20250084821
- Publication date Mar 13, 2025
- Ming-Feng Cheng
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MULTIPLE EXECUTABLE BINARIES WITH STATIC LINKS
- Publication number 20250053384
- Publication date Feb 13, 2025
- MEDIATEK INC.
- Wei-Chun KAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...
- Publication number 20250038008
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsiang Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SEMICONDU...
- Publication number 20250040201
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Shuan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Battery Module, Battery Device, and Battery System Having Thermal M...
- Publication number 20240429488
- Publication date Dec 26, 2024
- Yun Energy Limited Company
- MING YAO CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240395902
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures with Compact Copper Conductive Features
- Publication number 20240387604
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE
- Publication number 20240383744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Ming-Kun Cheng

Person

Patents Grantslast 30 patents

Semiconductor device and method

Electro-acoustical transducer device

Modem performance enhancement via smart transmission power distribu...

Method of logical channel prioritization to support sidelink relay

Semiconductor devices with air gaps and the method thereof

Die bonding pads and methods of forming the same

Substrate and package structure

Semiconductor device and method

Semiconductor device, semiconductor package, and methods of manufac...

Multi-channel devices and method with anti-punch through process

Semiconductor packages having conductive pillars with inclined surf...

Security mechanism for connection establishment over multi-hop side...

Semiconductor package structure comprising via structure and redist...

Capacitor between two passivation layers with different etching rates

Semiconductor device and method

Package structure and method of forming the same

Method and server for handling streaming data

Metal bumps and method forming same

Package structure with warpage-control element

Arched membrane structure for MEMS device

Method for exchanging data and non-transitory computer-readable med...

Semiconductor device with tunable channel layer usage and methods o...

Image capturing assembly

Apparatuses and methods for SideLink (SL) communication in a User E...

Dielectric fins with air gap and backside self-aligned contact

Partial sensing enhancement for sidelink resource allocation

Semiconductor device structure

Semiconductor device and method

Organic interposer including a dual-layer inductor structure and me...

Tools and systems for processing semiconductor devices, and methods...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

SEMICONDUCTOR PACKAGE STRUCTURE

CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES

Semiconductor Device and Method

Semiconductor Device With Tunable Channel Layer Usage And Methods O...

METHOD AND SERVER FOR HANDLING STREAMING DATA

IDENTIFICATION METHOD AND IDENTIFICATION SYSTEM FOR LICENSE PLATE

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

METAL BUMPS AND METHOD FORMING SAME

INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME

EDGE-COMPUTING METHOD FOR AUTOMATIC LICENSE PLATE RECOGNITION AND S...

METHOD FOR TRACKING OBJECT IN DYNAMIC SCENE AND SYSTEM THEREOF

PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...

PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME

MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE

RADIO FREQUENCY INDUCTOR

POWER GENERATION COMPLEMENTARY SYSTEM FOR TIDAL RANGE POWER GENERAT...

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

METHOD AND DEVICE FOR MULTIPLE EXECUTABLE BINARIES WITH STATIC LINKS

METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SEMICONDU...

Battery Module, Battery Device, and Battery System Having Thermal M...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor Structures with Compact Copper Conductive Features

ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE