Ming Li

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for fabricating a light-emitting diode package
- Patent number 8,956,892
- Issue date Feb 17, 2015
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS