Ming Liu

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Troy, MI, US

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Patents Grantslast 30 patents

Information Patent Grant
3-D power modules with double sided cooling per semiconductor die
- Patent number 11,876,034
- Issue date Jan 16, 2024
- GM Global Technology Operations LLC
- Muhammad H. Alvi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar power module with high power density packaging
- Patent number 11,817,750
- Issue date Nov 14, 2023
- GM Global Technology Operations LLC
- Ming Liu
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
3-D POWER MODULES WITH DOUBLE SIDED COOLING PER SEMICONDUCTOR DIE
- Publication number 20220310481
- Publication date Sep 29, 2022
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Muhammad H. ALVI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING MATERIAL FOR BONDING OVERLAPPING COMPONENTS OF POWER ELECTR...
- Publication number 20220230984
- Publication date Jul 21, 2022
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Ming Liu
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER MODULE WITH VASCULAR JET IMPINGEMENT COOLING SYSTEM
- Publication number 20220230938
- Publication date Jul 21, 2022
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Anthony M. Coppola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR POWER MODULE WITH HIGH POWER DENSITY PACKAGING
- Publication number 20220224206
- Publication date Jul 14, 2022
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Ming Liu
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE FOR POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20220130735
- Publication date Apr 28, 2022
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Anthony M. Coppola
- H01 - BASIC ELECTRIC ELEMENTS