Ming-Song Sheu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming integrated circuit having guard rings
- Patent number 11,398,467
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming integrated circuit having guard rings
- Patent number 10,756,079
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 10,269,750
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits using guard rings for ESD systems, and methods...
- Patent number 9,748,361
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 9,659,890
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting flip-chip package using pre-applied fillet
- Patent number 9,620,414
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 9,136,235
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting flip-chip package using pre-applied fillet
- Patent number 9,064,881
- Issue date Jun 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits using guard rings for ESD, systems, and methods...
- Patent number 8,772,092
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of under bump metallization in packaging semi...
- Patent number 8,569,886
- Issue date Oct 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection device and method
- Patent number 8,551,835
- Issue date Oct 8, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection device comprising a plurality of...
- Patent number 8,378,422
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits using guard rings for ESD, systems, and methods...
- Patent number 8,344,416
- Issue date Jan 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING INTEGRATED CIRCUIT HAVING GUARD RINGS
- Publication number 20200357787
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING INTEGRATED CIRCUIT HAVING GUARD RINGS
- Publication number 20170338218
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20170256512
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD SYSTEMS, AND METHODS...
- Publication number 20170186741
- Publication date Jun 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20160005704
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protecting Flip-Chip Package using Pre-Applied Fillet
- Publication number 20150287640
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD SYSTEMS, AND METHODS...
- Publication number 20140299913
- Publication date Oct 9, 2014
- Ming-Song SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20140057431
- Publication date Feb 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic Discharge Protection Device and Method
- Publication number 20130157430
- Publication date Jun 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20130127052
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD, SYSTEMS, AND METHODS...
- Publication number 20130084680
- Publication date Apr 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protecting Flip-Chip Package using Pre-Applied Fillet
- Publication number 20120119354
- Publication date May 17, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD, SYSTEMS, AND METHODS...
- Publication number 20100289057
- Publication date Nov 18, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Song SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic Discharge Protection Device and Method
- Publication number 20100200922
- Publication date Aug 12, 2010
- Ming-Song Sheu
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Song Sheu

Person

Patents Grantslast 30 patents

Methods for forming integrated circuit having guard rings

Methods for forming integrated circuit having guard rings

Methods and apparatus of packaging semiconductor devices

Integrated circuits using guard rings for ESD systems, and methods...

Methods and apparatus of packaging semiconductor devices

Protecting flip-chip package using pre-applied fillet

Methods and apparatus of packaging semiconductor devices

Protecting flip-chip package using pre-applied fillet

Integrated circuits using guard rings for ESD, systems, and methods...

Methods and apparatus of under bump metallization in packaging semi...

Electrostatic discharge protection device and method

Electrostatic discharge protection device comprising a plurality of...

Integrated circuits using guard rings for ESD, systems, and methods...

Patents Applicationslast 30 patents

METHODS FOR FORMING INTEGRATED CIRCUIT HAVING GUARD RINGS

METHODS FOR FORMING INTEGRATED CIRCUIT HAVING GUARD RINGS

Methods and Apparatus of Packaging Semiconductor Devices

INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD SYSTEMS, AND METHODS...

Methods and Apparatus of Packaging Semiconductor Devices

Protecting Flip-Chip Package using Pre-Applied Fillet

INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD SYSTEMS, AND METHODS...

Methods and Apparatus of Packaging Semiconductor Devices

Electrostatic Discharge Protection Device and Method

Methods and Apparatus of Packaging Semiconductor Devices

INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD, SYSTEMS, AND METHODS...

Protecting Flip-Chip Package using Pre-Applied Fillet

INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD, SYSTEMS, AND METHODS...

Electrostatic Discharge Protection Device and Method