Ming-Tak Ho

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Device for generating depth information, method for generating dept...
- Patent number 10,033,987
- Issue date Jul 24, 2018
- eYs3D Microelectronics, Co.
- Ben Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image calibration system and calibration method of a stereo camera
- Patent number 10,009,595
- Issue date Jun 26, 2018
- eYs3D Microelectronics, Co.
- Wen-Kuo Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image capturing method for image recognition and system thereof
- Patent number 9,373,035
- Issue date Jun 21, 2016
- eYs3D Microelectronics, Co.
- Ben Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Oligonucleotides targeting the UL73 gene region and use thereof
- Patent number 7,736,849
- Issue date Jun 15, 2010
- Taipei Veterans General Hospital, VAC
- Yu-Jiun Chan
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Flip chip stacked package
- Patent number 7,291,924
- Issue date Nov 6, 2007
- Advanced Semiconductor Engineering, Inc.
- Sung-Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of cutting electronic package
- Patent number 7,220,619
- Issue date May 22, 2007
- Advanced Semiconductor Engineering, Inc.
- Ming-Lun Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for flip chip bonding by utilizing an interposer with embedd...
- Patent number 7,098,071
- Issue date Aug 29, 2006
- Advanced Semiconductor Engineering, Inc.
- Ming-Lun Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package structure
- Patent number 7,019,407
- Issue date Mar 28, 2006
- Advanced Semiconductor Engineering, Inc.
- Yu-Wen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure with dual heat sinks
- Patent number 7,002,246
- Issue date Feb 21, 2006
- Advanced Semiconductor Engineering, Inc.
- Ming-Lun Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AUDIO GENERATION DEVICE AND METHOD FOR BRAIN DYNAMICS AUDIO STIMULA...
- Publication number 20240173515
- Publication date May 30, 2024
- Ming-Chung HO
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
OZONE GENERATOR AND OZONE GENERATING METHOD
- Publication number 20230008171
- Publication date Jan 12, 2023
- Industrial Technology Research Institute
- Kuan-Lun PAN
- C01 - INORGANIC CHEMISTRY
Information Patent Application
IMAGE CALIBRATION SYSTEM AND CALIBRATION METHOD OF A STEREO CAMERA
- Publication number 20160073092
- Publication date Mar 10, 2016
- ETRON TECHNOLOGY, INC.
- Wen-Kuo Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MAKING UP A SKIN TONE OF A HUMAN BODY IN AN IMAGE, DEVIC...
- Publication number 20150302564
- Publication date Oct 22, 2015
- ETRON TECHNOLOGY, INC.
- Ming-Che Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE FOR GENERATING DEPTH INFORMATION, METHOD FOR GENERATING DEPT...
- Publication number 20150208057
- Publication date Jul 23, 2015
- ETRON TECHNOLOGY, INC.
- Ben Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE CALIBRATION SYSTEM AND CALIBRATION METHOD OF A STEREO CAMERA
- Publication number 20150103147
- Publication date Apr 16, 2015
- ETRON TECHNOLOGY, INC.
- Ming-Che Ho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE CAPTURING METHOD FOR IMAGE RECOGNITION AND SYSTEM THEREOF
- Publication number 20130329947
- Publication date Dec 12, 2013
- ETRON TECHNOLOGY, INC.
- Ben Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stereoscopic Image Processor, Stereoscopic Image Interaction System...
- Publication number 20130215112
- Publication date Aug 22, 2013
- ETRON TECHNOLOGY, INC.
- Ming-Che Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Image Interaction Device, Interactive Image Operating System, and I...
- Publication number 20120268551
- Publication date Oct 25, 2012
- Ben Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR AMPLIFYING ADENOSINE TRIPHOSPHATE AND METHOD AND REAGENT...
- Publication number 20120034635
- Publication date Feb 9, 2012
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ching-Yi Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and Kits for Detecting Human Cytomegalovirus
- Publication number 20080032280
- Publication date Feb 7, 2008
- TAIPEI VETERANS GENERAL HOSPITAL, VAC
- Yu-Jiun Chan
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
Method for flip chip bonding by utilizing an interposer with embedd...
- Publication number 20060088953
- Publication date Apr 27, 2006
- Advanced Semiconductor Engineering, Inc.
- Ming-Lun Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF
- Publication number 20050282311
- Publication date Dec 22, 2005
- Yu-Wen Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PROCESS OF CUTTING ELECTRONIC PACKAGE
- Publication number 20050148159
- Publication date Jul 7, 2005
- Ming-Lun Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip stacked package
- Publication number 20050046040
- Publication date Mar 3, 2005
- Advanced Semiconductor Engineering, Inc.
- Sung-Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[CHIP PACKAGE STRUCTURE]
- Publication number 20050001311
- Publication date Jan 6, 2005
- Ming-Lun Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[FLIP CHIP PACKAGE STRUCTURE]
- Publication number 20040124540
- Publication date Jul 1, 2004
- YU-WEN CHEN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
[FLIP-CHIP SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF]
- Publication number 20040119171
- Publication date Jun 24, 2004
- Yu-Wen Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Ming-Tak Ho

Person

Patents Grantslast 30 patents

Device for generating depth information, method for generating dept...

Image calibration system and calibration method of a stereo camera

Image capturing method for image recognition and system thereof

Oligonucleotides targeting the UL73 gene region and use thereof

Flip chip stacked package

Process of cutting electronic package

Method for flip chip bonding by utilizing an interposer with embedd...

Flip chip package structure

Chip package structure with dual heat sinks

Patents Applicationslast 30 patents

AUDIO GENERATION DEVICE AND METHOD FOR BRAIN DYNAMICS AUDIO STIMULA...

OZONE GENERATOR AND OZONE GENERATING METHOD

IMAGE CALIBRATION SYSTEM AND CALIBRATION METHOD OF A STEREO CAMERA

METHOD FOR MAKING UP A SKIN TONE OF A HUMAN BODY IN AN IMAGE, DEVIC...

DEVICE FOR GENERATING DEPTH INFORMATION, METHOD FOR GENERATING DEPT...

IMAGE CALIBRATION SYSTEM AND CALIBRATION METHOD OF A STEREO CAMERA

IMAGE CAPTURING METHOD FOR IMAGE RECOGNITION AND SYSTEM THEREOF

Stereoscopic Image Processor, Stereoscopic Image Interaction System...

Image Interaction Device, Interactive Image Operating System, and I...

METHOD FOR AMPLIFYING ADENOSINE TRIPHOSPHATE AND METHOD AND REAGENT...

Method and Kits for Detecting Human Cytomegalovirus

Method for flip chip bonding by utilizing an interposer with embedd...

FLIP-CHIP SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF

PROCESS OF CUTTING ELECTRONIC PACKAGE

Flip chip stacked package

[CHIP PACKAGE STRUCTURE]

[FLIP CHIP PACKAGE STRUCTURE]

[FLIP-CHIP SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF]