Ming-Teng HSIEH

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Hefei, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of metal lines, method of fabricating the...
- Patent number 11,183,421
- Issue date Nov 23, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230292493
- Publication date Sep 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Renhu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTELLIGENT DETECTION SYSTEM, INTELLIGENT DETECTION M...
- Publication number 20220285183
- Publication date Sep 8, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ya MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...
- Publication number 20220013479
- Publication date Jan 13, 2022
- Changxin Memory Technologies, Inc.
- Ming-Teng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF METAL LINES, METHOD OF FABRICATING THE...
- Publication number 20200258772
- Publication date Aug 13, 2020
- Changxin Memory Technologies, Inc.
- Ming-Teng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS