Ming-Wei Tien

Follow

Person

Taipei Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipating device and heat dissipating fin
- Patent number 9,562,725
- Issue date Feb 7, 2017
- Wistron Corporation
- Yen-Yu Chao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device with component detaching function
- Patent number 9,307,677
- Issue date Apr 5, 2016
- Wistron Corporation
- Yao-De Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH COMPONENT DETACHING FUNCTION
- Publication number 20150146381
- Publication date May 28, 2015
- Wistron Corporation
- Yao-De Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING DEVICE AND HEAT DISSIPATING FIN
- Publication number 20140124173
- Publication date May 8, 2014
- Wistron Corporation
- Yen-Yu Chao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat Dissipating Device And Heat Dissipating Fin
- Publication number 20110100610
- Publication date May 5, 2011
- Wistron Corporation
- Yen-Yu Chao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT-DISSIPATING DEVICE
- Publication number 20100061060
- Publication date Mar 11, 2010
- Wistron Corporation
- Ming-Wei TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface bonding method for PET film and silica gel buttons and a ma...
- Publication number 20060121243
- Publication date Jun 8, 2006
- SILITECH TECHNOLOGY CORP.
- Yao-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS