Ming X. Chan

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Milpitas, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatuses and methods for high speed bonding
- Patent number 7,576,656
- Issue date Aug 18, 2009
- Alien Technology Corporation
- Gordon S. W. Craig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for forming an electronic assembly
- Patent number 7,080,444
- Issue date Jul 25, 2006
- Alien Technology Corporation
- Gordon S. W. Craig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus for block assembly process
- Publication number 20070082464
- Publication date Apr 12, 2007
- Kenneth David Schatz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses and methods for high speed bonding
- Publication number 20070057796
- Publication date Mar 15, 2007
- Gordon S. W. Craig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for moving blocks
- Publication number 20060269689
- Publication date Nov 30, 2006
- Gordon S. W. Craig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR