Ming Xia Wu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including dual pad wire bond interconnection
- Patent number 10,483,239
- Issue date Nov 19, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including die bond pads at a die edge
- Patent number 10,128,218
- Issue date Nov 13, 2018
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION
- Publication number 20180190621
- Publication date Jul 5, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE
- Publication number 20180175006
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS