Ming Xiang Li

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-via interconnect structure and method of manufacture
- Patent number 9,425,150
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated Schottky diode and power MOSFET
- Patent number 8,022,446
- Issue date Sep 20, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE FABRICATION PROCESS
- Publication number 20240222594
- Publication date Jul 4, 2024
- Sakuu Corporation
- Nojan ALIAHMAD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MULTI-VIA INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20150228584
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Schottky Diode and Power MOSFET
- Publication number 20090020826
- Publication date Jan 22, 2009
- Wan-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS