Ming-Yen Chiu

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Ping-Tung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for wafer level packaging and fabricating cap structures
- Patent number 7,598,125
- Issue date Oct 6, 2009
- Touch Micro-System Technology INC.
- Shih-Feng Shao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for wafer level packaging and fabricating cap structures
- Patent number 7,510,947
- Issue date Mar 31, 2009
- Touch Micro-System Technology Inc.
- Shih-Feng Shao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating microconnectors
- Patent number 7,393,774
- Issue date Jul 1, 2008
- Touch Micro-System Technology Inc.
- Ming-Yen Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING MICRO CONNECTORS
- Publication number 20080200023
- Publication date Aug 21, 2008
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MICROCONNECTORS
- Publication number 20070259508
- Publication date Nov 8, 2007
- Ming-Yen Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR WAFER LEVEL PACKAGING AND FABRICATING CAP STRUCTURES
- Publication number 20070161158
- Publication date Jul 12, 2007
- Shih-Feng Shao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR WAFER LEVEL PACKAGING AND FABRICATING CAP STRUCTURES
- Publication number 20070161210
- Publication date Jul 12, 2007
- Shih-Feng Shao
- B81 - MICRO-STRUCTURAL TECHNOLOGY