Ming Yeun Luke Wan

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
High precision bonding apparatus comprising heater
- Patent number 11,552,031
- Issue date Jan 10, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for heating a substrate during die bonding
- Patent number 10,199,350
- Issue date Feb 5, 2019
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bond force control
- Patent number 6,616,031
- Issue date Sep 9, 2003
- ASM Assembly Automation Limited
- Sun Kuen Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH PRECISION BONDING APPARATUS COMPRISING HEATER
- Publication number 20210288004
- Publication date Sep 16, 2021
- ASM Technology Singapore Pte Ltd
- Ming Yeung Luke WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION
- Publication number 20210225800
- Publication date Jul 22, 2021
- ASM Technology Singapore Pte Ltd
- Ming Yeung WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING
- Publication number 20130316294
- Publication date Nov 28, 2013
- Ming Yeung Luke WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High precision die bonding apparatus
- Publication number 20070134904
- Publication date Jun 14, 2007
- ASM Assembly Automation Ltd
- Ming Yeun Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS