Ming-Yin Ko

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Hsinchu County, TW

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...
- Publication number 20230402416
- Publication date Dec 14, 2023
- Airoha Technology (HK) Limited
- Huan-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING GROUND BONDING WIRE THAT CROSSES OVER...
- Publication number 20230402818
- Publication date Dec 14, 2023
- Airoha Technology Corp.
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ADHESIVE THAT OVERFLOWS FOR R...
- Publication number 20230238349
- Publication date Jul 27, 2023
- Airoha Technology (HK) Limited
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS