Ming YIN

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Zhejiang, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wafer de-bonding device
- Patent number 10,204,813
- Issue date Feb 12, 2019
- Zhejiang Microtech Material Co., Ltd.
- Ming Yin
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER DE-BONDING DEVICE
- Publication number 20180108558
- Publication date Apr 19, 2018
- Zhejiang Microtech Material Co., Ltd.
- Ming YIN
- B32 - LAYERED PRODUCTS