Ming Ying

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit protruding pad package system and method for man...
- Patent number 8,587,098
- Issue date Nov 19, 2013
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with die and package combination
- Patent number 8,102,040
- Issue date Jan 24, 2012
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system with substrate having different bondab...
- Patent number 7,986,032
- Issue date Jul 26, 2011
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit protruding pad package system
- Patent number 7,968,377
- Issue date Jun 28, 2011
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with passive device integration
- Patent number 7,960,816
- Issue date Jun 14, 2011
- ST Assembly Test Services Ltd.
- Seng Guan Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package system with substrate having different bondab...
- Patent number 7,598,599
- Issue date Oct 6, 2009
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with die and package combination
- Patent number 7,598,606
- Issue date Oct 6, 2009
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking lead frame system
- Patent number 7,388,280
- Issue date Jun 17, 2008
- Stats Chippac Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die packaging and fabrication method
- Patent number 7,064,430
- Issue date Jun 20, 2006
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with passive device integration
- Patent number 7,005,325
- Issue date Feb 28, 2006
- ST Assembly Test Services Ltd.
- Seng Guan Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM AND METHOD FOR MAN...
- Publication number 20110233744
- Publication date Sep 29, 2011
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIE AND PACKAGE COMBINATION
- Publication number 20090309207
- Publication date Dec 17, 2009
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDAB...
- Publication number 20090309237
- Publication date Dec 17, 2009
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDAB...
- Publication number 20070210422
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM
- Publication number 20070063322
- Publication date Mar 22, 2007
- STATS ChipPAC Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION
- Publication number 20060197198
- Publication date Sep 7, 2006
- ST ASSEMBLY TEST SERVICES LTD.
- Seng Guan Chow
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIE AND PACKAGE COMBINATION
- Publication number 20060197207
- Publication date Sep 7, 2006
- STATS ChipPAC Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKING LEAD FRAME SYSTEM
- Publication number 20060186514
- Publication date Aug 24, 2006
- STATS ChipPAC Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die packaging and fabrication method
- Publication number 20060043559
- Publication date Mar 2, 2006
- STATS ChipPAC Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with passive device integration
- Publication number 20050173783
- Publication date Aug 11, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Seng Guan Chow
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Person

Patents Grantslast 30 patents

Integrated circuit protruding pad package system and method for man...

Integrated circuit package system with die and package combination

Semiconductor package system with substrate having different bondab...

Integrated circuit protruding pad package system

Semiconductor package with passive device integration

Semiconductor package system with substrate having different bondab...

Integrated circuit package system with die and package combination

Package stacking lead frame system

Stacked die packaging and fabrication method

Semiconductor package with passive device integration

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM AND METHOD FOR MAN...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIE AND PACKAGE COMBINATION

SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDAB...

SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDAB...

INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM

SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIE AND PACKAGE COMBINATION

PACKAGE STACKING LEAD FRAME SYSTEM

Stacked die packaging and fabrication method

Semiconductor package with passive device integration