Mingchih CHEN

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JiangYin City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
- Publication number 20230049487
- Publication date Feb 16, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...
- Publication number 20220415803
- Publication date Dec 29, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...
- Publication number 20220415816
- Publication date Dec 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
- Publication number 20210280552
- Publication date Sep 9, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung TSAI
- H01 - BASIC ELECTRIC ELEMENTS