Mingda Huang

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Eindhoven, NL

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package
- Patent number 10,615,134
- Issue date Apr 7, 2020
- NXP B.V.
- Maristella Spella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC-package interconnect for millimeter wave systems
- Patent number 9,576,915
- Issue date Feb 21, 2017
- NXP B.V.
- Mingda Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit and method for detection of IC connection failure
- Patent number 9,435,842
- Issue date Sep 6, 2016
- NXP B.V.
- Cicero Silveira Vaucher
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20180233465
- Publication date Aug 16, 2018
- NXP B.V.
- Maristella SPELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC-PACKAGE INTERCONNECT FOR MILLIMETER WAVE SYSTEMS
- Publication number 20160190673
- Publication date Jun 30, 2016
- NXP B.V.
- Mingda Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT AND METHOD FOR DETECTION OF IC CONNECTION FAILURE
- Publication number 20150108996
- Publication date Apr 23, 2015
- NXP B.V.
- Cicero Silveira Vaucher
- G01 - MEASURING TESTING