Minghao Shen

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated fan-in semiconductor package with heat spreader and me...
- Patent number 11,488,931
- Issue date Nov 1, 2022
- CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic flat top integrated heat spreader (IHS)/electromagnetic in...
- Patent number 10,734,326
- Issue date Aug 4, 2020
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple wafers fabrication technique on large carrier with warpage...
- Patent number 10,424,524
- Issue date Sep 24, 2019
- CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded cavity fanout package without using a carrier and method of...
- Patent number 10,347,509
- Issue date Jul 9, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of manufacturing frameless LCD display
- Patent number 10,209,597
- Issue date Feb 19, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of embedding driver IC (EmDIC) in LCD display sub...
- Patent number 10,209,542
- Issue date Feb 19, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level fan-out wirebond packages
- Patent number 9,842,820
- Issue date Dec 12, 2017
- Altera Corporation
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless wafer level fan-out package
- Patent number 9,806,061
- Issue date Oct 31, 2017
- Altera Corporation
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-glass hybrid interposer circuitry
- Patent number 9,425,125
- Issue date Aug 23, 2016
- Altera Corporation
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with enhanced thermal conduction
- Patent number 9,385,060
- Issue date Jul 5, 2016
- Altera Corporation
- Vincent Hool
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED FAN-IN SEMICONDUCTOR PACKAGE WITH HEAT SPREADER AND ME...
- Publication number 20210242169
- Publication date Aug 5, 2021
- Chengdu ESWIN SiP Technology Co., Ltd.
- Minghao SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION FOR TEMPORARY BONDING OF SEMICONDUCTOR WORKPIE...
- Publication number 20190276712
- Publication date Sep 12, 2019
- Chengdu ESWIN SiP Technology Co., Ltd.
- Chunbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS FRAME FAN OUT PACKAGING AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190259675
- Publication date Aug 22, 2019
- DiDrew Technology (BVI) Limited
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE WAFERS FABRICATION TECHNIQUE ON LARGE CARRIER WITH WARPAGE...
- Publication number 20190252278
- Publication date Aug 15, 2019
- DiDrew Technology (BVI) Limited
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC FLAT TOP INTEGRATED HEAT SPREADER ( IHS)/ELECTROMAGNETIC I...
- Publication number 20190252324
- Publication date Aug 15, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS WAFER LEVEL FAN-OUT PACKAGE
- Publication number 20170287872
- Publication date Oct 5, 2017
- Altera Corporation
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-GLASS HYBRID INTERPOSER CIRCUITRY
- Publication number 20160336259
- Publication date Nov 17, 2016
- Altera Corporation
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-GLASS HYBRID INTERPOSER CIRCUITRY
- Publication number 20150235921
- Publication date Aug 20, 2015
- Altera Corporation
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS

Minghao Shen

Person

Patents Grantslast 30 patents

Encapsulated fan-in semiconductor package with heat spreader and me...

Hermetic flat top integrated heat spreader (IHS)/electromagnetic in...

Multiple wafers fabrication technique on large carrier with warpage...

Molded cavity fanout package without using a carrier and method of...

System and method of manufacturing frameless LCD display

System and method of embedding driver IC (EmDIC) in LCD display sub...

Wafer-level fan-out wirebond packages

Bumpless wafer level fan-out package

Silicon-glass hybrid interposer circuitry

Integrated circuit package with enhanced thermal conduction

Patents Applicationslast 30 patents

ENCAPSULATED FAN-IN SEMICONDUCTOR PACKAGE WITH HEAT SPREADER AND ME...

ADHESIVE COMPOSITION FOR TEMPORARY BONDING OF SEMICONDUCTOR WORKPIE...

GLASS FRAME FAN OUT PACKAGING AND METHOD OF MANUFACTURING THEREOF

MULTIPLE WAFERS FABRICATION TECHNIQUE ON LARGE CARRIER WITH WARPAGE...

HERMETIC FLAT TOP INTEGRATED HEAT SPREADER ( IHS)/ELECTROMAGNETIC I...

BUMPLESS WAFER LEVEL FAN-OUT PACKAGE

SILICON-GLASS HYBRID INTERPOSER CIRCUITRY

SILICON-GLASS HYBRID INTERPOSER CIRCUITRY