Minghsing Tsai

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electro-plating and apparatus for performing the same
- Patent number 11,535,950
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 10,985,054
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 10,714,383
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-plating and apparatus for performing the same
- Patent number 10,508,356
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 10,290,538
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 9,892,960
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-plating and apparatus for performing the same
- Patent number 9,518,334
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 9,401,329
- Issue date Jul 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 9,214,383
- Issue date Dec 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 9,142,450
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap filling method for dual damascene process
- Patent number 9,029,260
- Issue date May 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 8,980,745
- Issue date Mar 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-controlled formation of tin hard mask
- Patent number 8,975,187
- Issue date Mar 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Rueijer Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming pattern for semiconductor device
- Patent number 8,962,484
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Approach for reducing copper line resistivity
- Patent number 8,759,975
- Issue date Jun 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy shoulder structure for line stress reduction
- Patent number 8,692,351
- Issue date Apr 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Cheng Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for improving copper line cap formation
- Patent number 8,623,760
- Issue date Jan 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming MIM capacitor in a copper damascene interconnect
- Patent number 8,563,391
- Issue date Oct 22, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cluster processing apparatus for metallization processing in semico...
- Patent number 8,322,299
- Issue date Dec 4, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Approach for reducing copper line resistivity
- Patent number 8,242,016
- Issue date Aug 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for improving copper line cap formation
- Patent number 8,193,087
- Issue date Jun 5, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro chemical plating additives for improving stress and levelin...
- Patent number 7,771,579
- Issue date Aug 10, 2010
- Taiwan Semiconductor Manufacturing Co.
- Ting-Chu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ deposition for Cu hillock suppression
- Patent number 7,659,198
- Issue date Feb 9, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor in a copper damascene interconnect
- Patent number 7,483,258
- Issue date Jan 27, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal structure with sidewall passivation and method
- Patent number 7,446,047
- Issue date Nov 4, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Minghsing Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ deposition for cu hillock suppression
- Patent number 7,423,347
- Issue date Sep 9, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform passivation method for conductive features
- Patent number 7,413,976
- Issue date Aug 19, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Silicide structure for ultra-shallow junction for MOS devices
- Patent number 7,332,435
- Issue date Feb 19, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene interconnect structure with cap layer
- Patent number 7,259,463
- Issue date Aug 21, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Jen Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20200343128
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20190326156
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20180174886
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro-Plating and Apparatus for Performing the Same
- Publication number 20170081775
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20160329237
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Integrated Resputtering in a Physical Vapor...
- Publication number 20150206724
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chyang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20150061141
- Publication date Mar 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress-Controlled Formation of Tin Hard Mask
- Publication number 20140273470
- Publication date Sep 18, 2014
- Rueijer Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE STRUCTURE WITH A CAPPING STRUCTURE
- Publication number 20140264475
- Publication date Sep 18, 2014
- Rueijer Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20140264903
- Publication date Sep 18, 2014
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplating Chemical Leveler
- Publication number 20140262800
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20140252648
- Publication date Sep 11, 2014
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro-Plating and Apparatus for Performing the Same
- Publication number 20140251814
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method Of Semiconductor Integrated Circuit Fabrication
- Publication number 20140203437
- Publication date Jul 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERN FOR SEMICONDUCTOR DEVICE
- Publication number 20130157462
- Publication date Jun 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
- Chia Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILLING METHOD FOR DUAL DAMASCENE PROCESS
- Publication number 20120319278
- Publication date Dec 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel Approach for Reducing Copper Line Resistivity
- Publication number 20120292767
- Publication date Nov 22, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Improving Copper Line Cap Formation
- Publication number 20120190191
- Publication date Jul 26, 2012
- Taiwan Semiconductor Manufaturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY SHOULDER STRUCTURE FOR LINE STRESS REDUCTION
- Publication number 20110241207
- Publication date Oct 6, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Cheng Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for forming min capacitor in a copper damascene interconnect
- Publication number 20090111234
- Publication date Apr 30, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ Deposition for Cu Hillock Suppression
- Publication number 20090035937
- Publication date Feb 5, 2009
- Chung-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel approach for reducing copper line resistivity
- Publication number 20080286965
- Publication date Nov 20, 2008
- Hsien-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PLATING AND FABRICATION APPARATUS THEREOF
- Publication number 20080057211
- Publication date Mar 6, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Hsien Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for improving copper line cap formation
- Publication number 20070269978
- Publication date Nov 22, 2007
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS APPARATUSES
- Publication number 20070267461
- Publication date Nov 22, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-situ deposition for cu hillock suppression
- Publication number 20070164439
- Publication date Jul 19, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM capacitor in a copper damascene interconnect
- Publication number 20070132061
- Publication date Jun 14, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnection with conductive polymer layer and method of...
- Publication number 20060202346
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel silicide structure for ultra-shallow junction for MOS devices
- Publication number 20060205214
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal structure with sidewall passivation and method
- Publication number 20060189143
- Publication date Aug 24, 2006
- Minghsing Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Minghsing Tsai

Person

Patents Grantslast 30 patents

Electro-plating and apparatus for performing the same

Interconnect structure and method of forming the same

Interconnect structure and method of forming the same

Electro-plating and apparatus for performing the same

Interconnect structure and method of forming the same

Interconnect structure and method of forming the same

Electro-plating and apparatus for performing the same

Interconnect structure and method of forming the same

Method of semiconductor integrated circuit fabrication

Interconnect structure and method of forming the same

Gap filling method for dual damascene process

Interconnect structures and methods of forming same

Stress-controlled formation of tin hard mask

Method of forming pattern for semiconductor device

Approach for reducing copper line resistivity

Dummy shoulder structure for line stress reduction

Process for improving copper line cap formation

Method for forming MIM capacitor in a copper damascene interconnect

Cluster processing apparatus for metallization processing in semico...

Approach for reducing copper line resistivity

Process for improving copper line cap formation

Electro chemical plating additives for improving stress and levelin...

In-situ deposition for Cu hillock suppression

Copper interconnection with conductive polymer layer and method of...

MIM capacitor in a copper damascene interconnect

Metal structure with sidewall passivation and method

In-situ deposition for cu hillock suppression

Uniform passivation method for conductive features

Silicide structure for ultra-shallow junction for MOS devices

Damascene interconnect structure with cap layer

Patents Applicationslast 30 patents

Interconnect Structure and Method of Forming the Same

Interconnect Structure and Method of Forming the Same

Interconnect Structure and Method of Forming the Same

Electro-Plating and Apparatus for Performing the Same

Interconnect Structure and Method of Forming the Same

Systems and Methods for Integrated Resputtering in a Physical Vapor...

INTERCONNECT STRUCTURES AND METHODS OF FORMING SAME

Stress-Controlled Formation of Tin Hard Mask

MEMS DEVICE STRUCTURE WITH A CAPPING STRUCTURE

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

Electroplating Chemical Leveler

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

Electro-Plating and Apparatus for Performing the Same

Method Of Semiconductor Integrated Circuit Fabrication

METHOD OF FORMING PATTERN FOR SEMICONDUCTOR DEVICE

GAP FILLING METHOD FOR DUAL DAMASCENE PROCESS

Novel Approach for Reducing Copper Line Resistivity

Process for Improving Copper Line Cap Formation

DUMMY SHOULDER STRUCTURE FOR LINE STRESS REDUCTION

Method for forming min capacitor in a copper damascene interconnect

In-Situ Deposition for Cu Hillock Suppression

Novel approach for reducing copper line resistivity

METHODS FOR PLATING AND FABRICATION APPARATUS THEREOF

Process for improving copper line cap formation

PROCESS APPARATUSES

In-situ deposition for cu hillock suppression

MIM capacitor in a copper damascene interconnect

Copper interconnection with conductive polymer layer and method of...

Novel silicide structure for ultra-shallow junction for MOS devices

Metal structure with sidewall passivation and method