Mingu Lee

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus including bonding head
- Patent number 12,136,563
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Mingu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING BONDING HEAD
- Publication number 20220102185
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Mingu Lee
- H01 - BASIC ELECTRIC ELEMENTS