Mingyu WANG

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure and method for manufacturing the same, and m...
- Patent number 11,929,313
- Issue date Mar 12, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Mingyu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20250046699
- Publication date Feb 6, 2025
- Shanghai Avic Opto Electronics Co., Ltd.
- Huijun JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND M...
- Publication number 20220084923
- Publication date Mar 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Mingyu WANG
- H01 - BASIC ELECTRIC ELEMENTS