Minhua Li

Person

Sandy, UT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structure for dividing a substrate into individual devices
- Patent number 8,343,852
- Issue date Jan 1, 2013
- Fairchild Semiconductor Corporation
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with (110)-oriented silicon
- Patent number 8,338,886
- Issue date Dec 25, 2012
- Fairchild Semiconductor Corporation
- Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die packages using thin dies and metal substrates
- Patent number 8,329,508
- Issue date Dec 11, 2012
- Fairchild Semiconductor Corporation
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with (110)-oriented silicon
- Patent number 8,101,500
- Issue date Jan 24, 2012
- Fairchild Semiconductor Corporation
- Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for forming hybrid substrate
- Patent number 8,039,401
- Issue date Oct 18, 2011
- Fairchild Semiconductor Corporation
- Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for dividing a substrate into individual devices
- Patent number 7,951,688
- Issue date May 31, 2011
- Fairchild Semiconductor Corporation
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die packages using thin dies and metal substrates
- Patent number 7,768,075
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a semiconductor substrate to a metal substrate
- Patent number 7,635,635
- Issue date Dec 22, 2009
- Fairchild Semiconductor Corporation
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures formed on substrates and methods of manufa...
- Patent number 7,635,637
- Issue date Dec 22, 2009
- Fairchild Semiconductor Corporation
- Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH (110)-ORIENTED SILICON
- Publication number 20120086051
- Publication date Apr 12, 2012
- Fairchild Semiconductor Corporation
- Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES
- Publication number 20110201179
- Publication date Aug 18, 2011
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES
- Publication number 20100267200
- Publication date Oct 21, 2010
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES FORMED ON SUBSTRATES AND METHODS OF MANUFA...
- Publication number 20100052046
- Publication date Mar 4, 2010
- Fairchild Semiconductor Corporation
- Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Forming Hybrid Substrate
- Publication number 20090302482
- Publication date Dec 10, 2009
- Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH (110)-ORIENTED SILICON
- Publication number 20090179259
- Publication date Jul 16, 2009
- QI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Dividing a Substrate into Individual Devices
- Publication number 20090181520
- Publication date Jul 16, 2009
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding a semiconductor substrate to a metal substrate
- Publication number 20070238263
- Publication date Oct 11, 2007
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die packages using thin dies and metal substrates
- Publication number 20070235886
- Publication date Oct 11, 2007
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures formed on substrates and methods of manufa...
- Publication number 20070020884
- Publication date Jan 25, 2007
- Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method and structure for dividing a substrate into individual devices

Semiconductor device with (110)-oriented silicon

Semiconductor die packages using thin dies and metal substrates

Semiconductor device with (110)-oriented silicon

Structure and method for forming hybrid substrate

Method and structure for dividing a substrate into individual devices

Semiconductor die packages using thin dies and metal substrates

Method for bonding a semiconductor substrate to a metal substrate

Semiconductor structures formed on substrates and methods of manufa...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH (110)-ORIENTED SILICON

METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES

SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES

SEMICONDUCTOR STRUCTURES FORMED ON SUBSTRATES AND METHODS OF MANUFA...

Structure and Method for Forming Hybrid Substrate

SEMICONDUCTOR DEVICE WITH (110)-ORIENTED SILICON

Method and Structure for Dividing a Substrate into Individual Devices

Method for bonding a semiconductor substrate to a metal substrate

Semiconductor die packages using thin dies and metal substrates

Semiconductor structures formed on substrates and methods of manufa...