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Patents Grantslast 30 patents

Information Patent Grant
Polarization measuring device and method of fabricating semiconduct...
- Patent number 11,946,809
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Ingi Kim
- G01 - MEASURING TESTING
Information Patent Grant
Hyperspectral imaging (HSI) apparatus and inspection apparatus incl...
- Patent number 11,898,912
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Sungho Jang
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection apparatus and system including the same
- Patent number 11,823,927
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Kyunghun Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate inspection system and method of manufacturing semiconduct...
- Patent number 11,823,961
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Eunhee Jeang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240145315
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- EUNHEE JEANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD MONITORING SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240128102
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- SUNGHO JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEVEL SENSOR AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20240118072
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Sungho Jang
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL DEVICE, DIE BONDING SYSTEM, AND DIE BONDING METHOD
- Publication number 20240105524
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Hyungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ASSEMBLY FOR PARALLELISM MEASUREMENT, OPTICAL APPARATUS INC...
- Publication number 20230392925
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Jiyoung Chu
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL ASSEMBLY FOR ALIGNMENT INSPECTION, OPTICAL APPARATUS INCLUD...
- Publication number 20230094985
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Jiyoung CHU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLARIZATION MEASURING DEVICE AND METHOD OF FABRICATING SEMICONDUCT...
- Publication number 20230068376
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Ingi KIM
- G01 - MEASURING TESTING
Information Patent Application
HYPERSPECTRAL IMAGING (HSI) APPARATUS AND INSPECTION APPARATUS INCL...
- Publication number 20220170792
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Sungho Jang
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION APPARATUS AND SYSTEM INCLUDING THE SAME
- Publication number 20220068681
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Kyunghun Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210305106
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- EUNHEE JEANG
- H01 - BASIC ELECTRIC ELEMENTS

MINHWAN SEO

Person

Patents Grantslast 30 patents

Polarization measuring device and method of fabricating semiconduct...

Hyperspectral imaging (HSI) apparatus and inspection apparatus incl...

Wafer inspection apparatus and system including the same

Substrate inspection system and method of manufacturing semiconduct...

Patents Applicationslast 30 patents

SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...

APPARATUS AND METHOD MONITORING SEMICONDUCTOR MANUFACTURING EQUIPMENT

LEVEL SENSOR AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

OPTICAL DEVICE, DIE BONDING SYSTEM, AND DIE BONDING METHOD

OPTICAL ASSEMBLY FOR PARALLELISM MEASUREMENT, OPTICAL APPARATUS INC...

OPTICAL ASSEMBLY FOR ALIGNMENT INSPECTION, OPTICAL APPARATUS INCLUD...

POLARIZATION MEASURING DEVICE AND METHOD OF FABRICATING SEMICONDUCT...

HYPERSPECTRAL IMAGING (HSI) APPARATUS AND INSPECTION APPARATUS INCL...

WAFER INSPECTION APPARATUS AND SYSTEM INCLUDING THE SAME

SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...