Minjoon Park

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-situ focus ring coating
- Patent number 12,354,842
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Minjoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching tools and systems
- Patent number 12,334,356
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Minjoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for high aspect ratio carbon etching with inserted cha...
- Patent number 12,040,176
- Issue date Jul 16, 2024
- Tokyo Electron Limited
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAYER BY LAYER ETCH PROCESS
- Publication number 20250191929
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING WITH PHASE-LOCKED WAVEFORMS
- Publication number 20250166966
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Pingshan Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240347346
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Minjoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI LEVEL CONTACT ETCH
- Publication number 20240339328
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FOCUS RING COATING
- Publication number 20240249921
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Minjoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Etching with Metal Sputtering
- Publication number 20240249927
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Minjoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Removal via Multiple Flash Steps during Plasma Etch
- Publication number 20240234157
- Publication date Jul 11, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFICATION AND REDUCTION OF SELECTIVELY DEPOSITED Si PROTECTIVE...
- Publication number 20240222132
- Publication date Jul 4, 2024
- TOKYO ELECTRON LIMITED
- Jinying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Removal via Multiple Flash Steps during Plasma Etch
- Publication number 20240136195
- Publication date Apr 25, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES USING METAL HARDMASKS
- Publication number 20240079246
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING TOOLS AND SYSTEMS
- Publication number 20230395385
- Publication date Dec 7, 2023
- TOKYO ELECTRON LIMITED
- Minjoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Hardmasks
- Publication number 20230397416
- Publication date Dec 7, 2023
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Improving Etch Rate And Critical Dimension Uniformity Wh...
- Publication number 20230343598
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHA...
- Publication number 20230326737
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS

Minjoon Park

Person

Patents Grantslast 30 patents

In-situ focus ring coating

Plasma etching tools and systems

Technologies for high aspect ratio carbon etching with inserted cha...

Patents Applicationslast 30 patents

LAYER BY LAYER ETCH PROCESS

PLASMA PROCESSING WITH PHASE-LOCKED WAVEFORMS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

MULTI LEVEL CONTACT ETCH

IN-SITU FOCUS RING COATING

Plasma Etching with Metal Sputtering

Polymer Removal via Multiple Flash Steps during Plasma Etch

DENSIFICATION AND REDUCTION OF SELECTIVELY DEPOSITED Si PROTECTIVE...

Polymer Removal via Multiple Flash Steps during Plasma Etch

METHODS FOR FORMING SEMICONDUCTOR DEVICES USING METAL HARDMASKS

PLASMA ETCHING TOOLS AND SYSTEMS

Metal Hardmasks

Method For Improving Etch Rate And Critical Dimension Uniformity Wh...

TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHA...