MINJU KIM

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ChungCheongNam-Do, KR

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Patents Applicationslast 30 patents

Information Patent Application
Method Of Manufacturing Thin-Film Bonded Substrate Used For Semicon...
- Publication number 20130323906
- Publication date Dec 5, 2013
- SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
- Donghyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Substrate And Method Of Manufacturing The Same
- Publication number 20130093059
- Publication date Apr 18, 2013
- SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
- JongPil Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130093063
- Publication date Apr 18, 2013
- SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
- Joong Won Shur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate For Vertical Light-Emitting Diode
- Publication number 20130049009
- Publication date Feb 28, 2013
- SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
- KyoungJun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEAVING SUBSTRATE AND METHOD OF MANUFACTURING BONDED SUB...
- Publication number 20130029473
- Publication date Jan 31, 2013
- SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
- Dong-Woon KIM
- H01 - BASIC ELECTRIC ELEMENTS