Minjun BAE

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,014,975
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Jaegwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 11,973,028
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,948,872
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package
- Patent number 11,894,338
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 11,600,564
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package
- Patent number 11,264,354
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 10,950,539
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312886
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Jaegwon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240203850
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128155
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minjun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMIC...
- Publication number 20230187345
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415835
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Minjun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220310496
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220293501
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Jaegwon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE
- Publication number 20220157772
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Jinwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMIC...
- Publication number 20210183766
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE
- Publication number 20210104489
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- Jinwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20210020505
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Jaegwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMIC...
- Publication number 20200091066
- Publication date Mar 19, 2020
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package

Redistribution substrate, method of fabricating the same, and semic...

Semiconductor package and method of fabricating the same

Wafer level package

Redistribution substrate, method of fabricating the same, and semic...

Wafer level package

Redistribution substrate, method of fabricating the same, and semic...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMIC...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

WAFER LEVEL PACKAGE

REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMIC...

WAFER LEVEL PACKAGE

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMIC...