Minjung CHOI

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 12,080,663
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection pad structure for analysis in a semiconductor device
- Patent number 12,072,374
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,817,408
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including low-k dielectric layer
- Patent number 11,776,894
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including scribe lane and method of manufactu...
- Patent number 11,756,843
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,559
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,557,556
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including scribe lane and method of manufactu...
- Patent number 11,342,235
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,049,827
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20240047390
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20230230915
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20230154876
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230138616
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230077803
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-CAPPING LAYER AND METHOD FOR M...
- Publication number 20230080862
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH STEPPED SIDEWALL, SEMICONDUCTOR PACKAGE INC...
- Publication number 20230076238
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Junhyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE
- Publication number 20230067386
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- MINJUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE
- Publication number 20220326301
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...
- Publication number 20220223485
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305115
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210280541
- Publication date Sep 9, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...
- Publication number 20210175133
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20210057328
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210043591
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Minjung CHOI

Person

Patents Grantslast 30 patents

Semiconductor devices including a thick metal layer and a bump

Detection pad structure for analysis in a semiconductor device

Semiconductor devices including a thick metal layer and a bump

Semiconductor chip including low-k dielectric layer

Semiconductor devices including scribe lane and method of manufactu...

Semiconductor device

Semiconductor devices including a thick metal layer and a bump

Semiconductor devices including scribe lane and method of manufactu...

Semiconductor devices including a thick metal layer and a bump

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE INCLUDING MULTI-CAPPING LAYER AND METHOD FOR M...

SEMICONDUCTOR CHIP WITH STEPPED SIDEWALL, SEMICONDUCTOR PACKAGE INC...

SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE

DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP