MinKyung Kang

Follow

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with embedded pad on layered su...
- Patent number 10,134,664
- Issue date Nov 20, 2018
- STATS ChipPAC Pte. Ltd.
- MinKyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with embedded pad on layered su...
- Patent number 9,607,938
- Issue date Mar 28, 2017
- STATS ChipPAC Pte. Ltd.
- MinKyung Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240284658
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Minkyung KANG
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SPACER STRUCTURE HAVING AIR GAP
- Publication number 20240215225
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Teawon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SPACER STRUCTURE HAVING OXIDIZED REGION
- Publication number 20240081047
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Teawon Kim
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230209825
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Minkyung Kang
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SU...
- Publication number 20170162495
- Publication date Jun 8, 2017
- STATS ChipPAC Pte Ltd.
- MinKyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SU...
- Publication number 20150001705
- Publication date Jan 1, 2015
- MinKyung Kang
- H01 - BASIC ELECTRIC ELEMENTS