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Minoru EGUSA

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  • Chiyoda-ku, Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20210134686
    • Publication date May 6, 2021
    • Mitsubishi Electric Corporation
    • Hidetoshi Ishibashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRASONIC BONDING APPARATUS, ULTRASONIC BONDING INSPECTION METHOD...
    • Publication number 20200035642
    • Publication date Jan 30, 2020
    • MITSUBISHI ELECTRIC CORPORATION
    • Minoru EGUSA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20190103330
    • Publication date Apr 4, 2019
    • Mitsubishi Electric Corporation
    • Hidetoshi ISHIBASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Power Semiconductor Device
    • Publication number 20170194223
    • Publication date Jul 6, 2017
    • Mitsubishi Electric Corporation
    • Minoru Egusa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20160336245
    • Publication date Nov 17, 2016
    • Mitsubishi Electric Corporation
    • Minoru EGUSA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20160315022
    • Publication date Oct 27, 2016
    • MITSUBISHI ELECTRIC CORPORATION
    • Minoru EGUSA
    • H01 - BASIC ELECTRIC ELEMENTS