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Adhesive and semiconductor devices
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Patent number 6,750,550
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Issue date Jun 15, 2004
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Dow Corning Toray Silicone Co., Ltd.
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Kimio Yamakawa
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Adhesive and semiconductor devices
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Patent number 6,720,083
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Issue date Apr 13, 2004
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Dow Corning Toray Silicone Co., Ltd.
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Kimio Yamakawa
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Paste dispensing container
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Patent number 6,513,680
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Issue date Feb 4, 2003
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Dow Corning Toray Silicone Co., Ltd.
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Kazumi Nakayoshi
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B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
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Semiconductor devices
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Patent number 6,498,400
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Issue date Dec 24, 2002
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Dow Corning Toray Silicone Co., Ltd.
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Kimio Yamakawa
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H01 - BASIC ELECTRIC ELEMENTS
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Adhesive and semiconductor devices
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Patent number 6,410,642
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Issue date Jun 25, 2002
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Dow Corning Toray Silicone Co., Ltd.
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Kimio Yamakawa
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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