Minoru KAI

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor package including laser proce...
- Patent number 10,529,635
- Issue date Jan 7, 2020
- J-Devices Corporation
- Hisakazu Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press fitting head and semiconductor manufacturing apparatus using...
- Patent number 10,388,625
- Issue date Aug 20, 2019
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus having a pickup unit simultan...
- Patent number 10,157,760
- Issue date Dec 18, 2018
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTUR...
- Publication number 20170338136
- Publication date Nov 23, 2017
- J-DEVICES CORPORATION
- Minoru KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20170316998
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Hisakazu MARUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING...
- Publication number 20170110432
- Publication date Apr 20, 2017
- J-DEVICES CORPORATION
- Minoru KAI
- H01 - BASIC ELECTRIC ELEMENTS