Minoru Maruta

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Minamiashigara, JP

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Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding apparatus and quality monitoring method
- Patent number 5,431,324
- Issue date Jul 11, 1995
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR