TREA

Minoru Matsuzawa

Follow

Person

  • Tokyo, JP
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20240058922
    • Publication date Feb 22, 2024
    • Disco Corporation
    • Minoru MATSUZAWA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    JIG FOR MOUNTING AND DISMOUNTING PROCESSING TOOL
    • Publication number 20230201996
    • Publication date Jun 29, 2023
    • Disco Corporation
    • Minoru MATSUZAWA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210143063
    • Publication date May 13, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210143064
    • Publication date May 13, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210118736
    • Publication date Apr 22, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210118737
    • Publication date Apr 22, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210111074
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210111073
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210074588
    • Publication date Mar 11, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210074589
    • Publication date Mar 11, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD FOR WAFER
    • Publication number 20210057260
    • Publication date Feb 25, 2021
    • Disco Corporation
    • Minoru MATSUZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210043514
    • Publication date Feb 11, 2021
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210043513
    • Publication date Feb 11, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210013100
    • Publication date Jan 14, 2021
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210013101
    • Publication date Jan 14, 2021
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200388536
    • Publication date Dec 10, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200388537
    • Publication date Dec 10, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200357695
    • Publication date Nov 12, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200357696
    • Publication date Nov 12, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200328118
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200328117
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200286785
    • Publication date Sep 10, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200286784
    • Publication date Sep 10, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200266090
    • Publication date Aug 20, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200266102
    • Publication date Aug 20, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200235010
    • Publication date Jul 23, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200235011
    • Publication date Jul 23, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD FOR WAFER
    • Publication number 20200185252
    • Publication date Jun 11, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200185253
    • Publication date Jun 11, 2020
    • Disco Corporation
    • Shigenori HARADA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200144049
    • Publication date May 7, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS