Minoru Murata

Person

Oobu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device capable of suppressing cracks of through-hole...
- Patent number 10,468,322
- Issue date Nov 5, 2019
- Denso Corporation
- Kazuyuki Kakuta
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensing semiconductor device and method for manuf...
- Patent number 10,209,155
- Issue date Feb 19, 2019
- Denso Corporation
- Kouhei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid property sensor
- Patent number 7,692,432
- Issue date Apr 6, 2010
- Denso Corporation
- Takahiko Yoshida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Physical quantity sensor having multiple through holes
- Patent number 7,337,670
- Issue date Mar 4, 2008
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensor having movable portion
- Patent number 7,302,847
- Issue date Dec 4, 2007
- Nippon Soken, Inc.
- Takeshi Ito
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensor having multiple through holes
- Patent number 7,178,400
- Issue date Feb 20, 2007
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Method and unit for sensing physical quantity using capacitive sensor
- Patent number 7,168,320
- Issue date Jan 30, 2007
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor dynamic sensor, and methods of transport and collet s...
- Patent number 7,005,313
- Issue date Feb 28, 2006
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor dynamic quantity sensor with movable electrode and fi...
- Patent number 6,973,829
- Issue date Dec 13, 2005
- Denso Corporation
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive acceleration sensor
- Patent number 6,792,805
- Issue date Sep 21, 2004
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor physical quantity sensor
- Patent number 6,494,096
- Issue date Dec 17, 2002
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor physical quantity sensor
- Patent number 6,450,031
- Issue date Sep 17, 2002
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor acceleration sensor
- Patent number 6,448,624
- Issue date Sep 10, 2002
- Denso Corporation
- Seiichiro Ishio
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor physical quantity sensor including frame-shaped beam...
- Patent number 6,430,999
- Issue date Aug 13, 2002
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor dynamic quantity sensor
- Patent number 6,423,563
- Issue date Jul 23, 2002
- Denso Corporation
- Tsuyoshi Fukada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor dynamic quantity sensor
- Patent number 6,287,885
- Issue date Sep 11, 2001
- Denso Corporation
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor physical quantity sensor having movable portion and f...
- Patent number 6,276,207
- Issue date Aug 21, 2001
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor physical quantity sensor
- Patent number 6,250,165
- Issue date Jun 26, 2001
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor with ring-shaped movable electrode
- Patent number 6,199,430
- Issue date Mar 13, 2001
- Denso Corporation
- Kazuhiko Kano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor dynamical quantity sensor device having electrodes in...
- Patent number 6,151,966
- Issue date Nov 28, 2000
- Denso Corporation
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabrication of a semiconductor sensor
- Patent number 6,143,584
- Issue date Nov 7, 2000
- Denso Corporation
- Tsuyoshi Fukada
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing semiconductor device by dicing
- Patent number 5,998,234
- Issue date Dec 7, 1999
- Denso Corporation
- Minoru Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for magnetoresistance elements
- Patent number 5,618,738
- Issue date Apr 8, 1997
- Nippondenso Co., Ltd.
- Kenichi Ao
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SENSOR
- Publication number 20190204171
- Publication date Jul 4, 2019
- DENSO CORPORATION
- Akira INABA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190051575
- Publication date Feb 14, 2019
- Denso Corporation
- Kazuyuki KAKUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180172530
- Publication date Jun 21, 2018
- Denso Corporation
- Kouhei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Element Portion and Method of Producing...
- Publication number 20090194827
- Publication date Aug 6, 2009
- Masahiro Ogino
- G01 - MEASURING TESTING
Information Patent Application
Liquid property sensor
- Publication number 20080100309
- Publication date May 1, 2008
- DENSO CORPORATION
- Takahiko Yoshida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Physical quantity sensor having multiple through holes
- Publication number 20070120205
- Publication date May 31, 2007
- DENSO CORPORATION
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Application
Physical quantity sensor having movable portion
- Publication number 20060055096
- Publication date Mar 16, 2006
- NIPPON SOKEN, INC.
- Takeshi Ito
- G01 - MEASURING TESTING
Information Patent Application
Physical quantity sensor having multiple through holes
- Publication number 20050229704
- Publication date Oct 20, 2005
- DENSO Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Application
Method and unit for sensing physical quantity using capacitive sensor
- Publication number 20050016273
- Publication date Jan 27, 2005
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor dynamic sensor, and methods of transport and collet s...
- Publication number 20040187575
- Publication date Sep 30, 2004
- DENSO Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Application
Capacitive acceleration sensor
- Publication number 20030164043
- Publication date Sep 4, 2003
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor dynamic quantity sensor with movable electrode and fi...
- Publication number 20020023492
- Publication date Feb 28, 2002
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing semiconductor dynamic quantity sensor
- Publication number 20010029060
- Publication date Oct 11, 2001
- DENSO Corporation
- Tsuyoshi Fukada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor physical quantity sensor
- Publication number 20010025530
- Publication date Oct 4, 2001
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor physical quantity sensor including frame-shaped beam...
- Publication number 20010025529
- Publication date Oct 4, 2001
- Minoru Murata
- G01 - MEASURING TESTING

Minoru Murata

Person

Patents Grantslast 30 patents

Semiconductor device capable of suppressing cracks of through-hole...

Physical quantity sensing semiconductor device and method for manuf...

Liquid property sensor

Physical quantity sensor having multiple through holes

Physical quantity sensor having movable portion

Physical quantity sensor having multiple through holes

Method and unit for sensing physical quantity using capacitive sensor

Semiconductor dynamic sensor, and methods of transport and collet s...

Semiconductor dynamic quantity sensor with movable electrode and fi...

Capacitive acceleration sensor

Semiconductor physical quantity sensor

Semiconductor physical quantity sensor

Semiconductor acceleration sensor

Semiconductor physical quantity sensor including frame-shaped beam...

Method for manufacturing semiconductor dynamic quantity sensor

Method for manufacturing semiconductor dynamic quantity sensor

Semiconductor physical quantity sensor having movable portion and f...

Semiconductor physical quantity sensor

Acceleration sensor with ring-shaped movable electrode

Semiconductor dynamical quantity sensor device having electrodes in...

Method for fabrication of a semiconductor sensor

Method of producing semiconductor device by dicing

Manufacturing method for magnetoresistance elements

Patents Applicationslast 30 patents

PRESSURE SENSOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device Having Element Portion and Method of Producing...

Liquid property sensor

Physical quantity sensor having multiple through holes

Physical quantity sensor having movable portion

Physical quantity sensor having multiple through holes

Method and unit for sensing physical quantity using capacitive sensor

Semiconductor dynamic sensor, and methods of transport and collet s...

Capacitive acceleration sensor

Semiconductor dynamic quantity sensor with movable electrode and fi...

Method for manufacturing semiconductor dynamic quantity sensor

Semiconductor physical quantity sensor

Semiconductor physical quantity sensor including frame-shaped beam...