Minoru Nakao

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, process fo...
- Patent number 6,962,957
- Issue date Nov 8, 2005
- Nitto Denko Corporation
- Hideyuki Usui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition of epoxy resin, phenolic resin, butadiene particles and...
- Patent number 6,596,813
- Issue date Jul 22, 2003
- Nitto Denko Corporation
- Hideyuki Usui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Butadiene rubber particles with secondary particle sizes for epoxy...
- Patent number 6,288,169
- Issue date Sep 11, 2001
- Nitto Denko Corporation
- Hideyuki Usui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Epoxy resin composition for semiconductor encapsulation, process fo...
- Publication number 20030211327
- Publication date Nov 13, 2003
- NITTO DENKO CORPORATION
- Hideyuki Usui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy resin composition for semiconductor encapsulation, process fo...
- Publication number 20030018132
- Publication date Jan 23, 2003
- NITTO DENKO CORPORATION
- Hideyuki Usui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...