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Minoru Numoto

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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer polisher
    • Patent number 7,056,196
    • Issue date Jun 6, 2006
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,840,845
    • Issue date Jan 11, 2005
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus utilizing an Oldham's coupling me...
    • Patent number 6,702,658
    • Issue date Mar 9, 2004
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,656,026
    • Issue date Dec 2, 2003
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,648,739
    • Issue date Nov 18, 2003
    • Tokyo Seimitsu Co., Ltd.
    • Hirohiko Izumi
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Structure of polishing head of polishing apparatus
    • Patent number 6,572,438
    • Issue date Jun 3, 2003
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing device
    • Patent number 6,485,358
    • Issue date Nov 26, 2002
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Apparatus for polishing wafers
    • Patent number 6,409,583
    • Issue date Jun 25, 2002
    • Tokyo Seimtsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer grinder and method of detecting grinding amount
    • Patent number 6,402,589
    • Issue date Jun 11, 2002
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,354,914
    • Issue date Mar 12, 2002
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing machine
    • Patent number 6,346,037
    • Issue date Feb 12, 2002
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,319,106
    • Issue date Nov 20, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,302,762
    • Issue date Oct 16, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer machining apparatus
    • Patent number 6,296,555
    • Issue date Oct 2, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,283,828
    • Issue date Sep 4, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Apparatus for polishing wafers
    • Patent number 6,273,804
    • Issue date Aug 14, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Polishing apparatus
    • Patent number 6,203,414
    • Issue date Mar 20, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,080,049
    • Issue date Jun 27, 2000
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,059,636
    • Issue date May 9, 2000
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,027,398
    • Issue date Feb 22, 2000
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Apparatus for determining removed amount of wafer
    • Patent number 5,948,206
    • Issue date Sep 7, 1999
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing machine
    • Patent number 5,931,725
    • Issue date Aug 3, 1999
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Surface texture measuring instrument
    • Patent number 4,765,181
    • Issue date Aug 23, 1988
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • G01 - MEASURING TESTING

Patents Applicationslast 30 patents

  • Information Patent Application

    Wafer polisher
    • Publication number 20040018806
    • Publication date Jan 29, 2004
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Wafer polishing apparatus
    • Publication number 20030096564
    • Publication date May 22, 2003
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Wafer polishing apparatus
    • Publication number 20020068517
    • Publication date Jun 6, 2002
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Structure of polishing head of polishing apparatus
    • Publication number 20010011003
    • Publication date Aug 2, 2001
    • Minoru Numoto
    • B24 - GRINDING POLISHING